Thermally aware performance analysis of single-walled carbon nanotube bundle as VLSI interconnects

Kumar, Mayank; Kaushik, Brajesh Kumar; Sarkar, S.

doi:10.1007/s10825-016-0793-6

Cited by 24 publications

(23 citation statements)

References 35 publications

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“…For all calculation and simulation purposes, the data shown in Table 1 have been used. 20,21,38,39 The result also illustrates that coupled copper interconnects have comparatively lower crosstalk-induced positive noise voltage peaks because of the control of its smaller self-inductance (L s ) and a larger ground capacitance (C g ) compared with MLGNR. These results show the significant reflection of temperature variation on interconnect resistance (see Figures 4 and 5).…”

Section: Crosstalk Analysismentioning

confidence: 84%

“…21,32,34,35 Based on this theory, the coupling capacitance of MLGNR interconnect is assumed to be same as that of copper-based interconnect with same dimensions. 21,32,34,35 Based on this theory, the coupling capacitance of MLGNR interconnect is assumed to be same as that of copper-based interconnect with same dimensions.…”

Section: Temperature-dependent Impedance Analysismentioning

confidence: 99%

“…This simulation setup is used with optimum number of repeaters. 16,21,36,37 A power dissipation ratio (MLGNR/Cu) for long (~1 mm) interconnect with rise in temperature, ranging from 300 K to 500 K, is illustrated in Figure 8 at 22 nm technology node. Copper-interconnect propagation delay and power dissipation are used to normalize corresponding MLGNR-interconnect propagation delays and powers, respectively.…”

Section: Delay and Power Analysismentioning

confidence: 99%

“…A few prior studies have investigated the influence of temperature variations on the electrical transport of carbon material-based nanoscale interconnects. 20,21 Very few significant researches have been done work on crosstalk in coupled interconnects of MLGNR. This is because the interconnect resistance increases with rise in temperature.…”

Section: Introductionmentioning

confidence: 99%

“…A few prior studies have investigated the influence of temperature variations on the electrical transport of carbon material-based nanoscale interconnects. [18][19][20][21] It is found that the temperature variations above room temperature have a significant effect on interconnect performance in terms of delay, power dissipation, and crosstalk. This is because the interconnect resistance increases with rise in temperature.…”

Section: Introductionmentioning

confidence: 99%

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Temperature‐dependent modeling and performance analysis of coupled MLGNR interconnects

Kumar

Arora

Kaushik

2017

Circuit Theory & Apps

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The temperature-dependent circuit modeling and performance in terms of propagation delay, power dissipation, and crosstalk-induced voltage waveform at the far end of victim line of multilayer graphene nanoribbon (MLGNR) interconnects have been analyzed at 22 nm technology node. A comparative performance analysis between MLGNR interconnects with resistance estimated using temperature-dependent model and temperature-independent model is examined. The results obtained are also compared with capacitively coupled interconnects of copper (Cu). The results show that as the temperature is varied from 300 K to 500 K, MLGNR has lower propagation delay and power dissipation as compared to Cu for 1 mm long interconnects. It is also observed that because of the dominance of both low resistance and ground capacitance compared to Cu, MLGNR has better crosstalk-induced delay and voltage waveforms with rise in temperature at the far end of aggressor and victim line, respectively. Further, simulated results show an average relative improvement in propagation delay of 37.24% and corresponding improvement in power dissipation of approximately 19.59% by using a temperature-dependent model in comparison to a temperature-independent model of MLGNR resistance with interconnect lengths varying from 200 to 1000 μm. The reduction in the time duration of victim output pulse over these interconnect lengths also shows a significant improvement of approximately 35% by using temperature-dependent model as against temperature-independent model of MLGNR resistance.

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Section: Crosstalk Analysismentioning

confidence: 84%

Section: Temperature-dependent Impedance Analysismentioning

confidence: 99%

Section: Delay and Power Analysismentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Temperature‐dependent modeling and performance analysis of coupled MLGNR interconnects

Kumar

Arora

Kaushik

2017

Circuit Theory & Apps

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Structure optimization: Configuring optimum performance of randomly distributed mixed carbon nanotube bundle interconnects

Sharma

Kumar

Khanna

2023

Circuit Theory & Apps

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SummaryThis paper presents an efficient optimization strategy based on the Stoyan and Yaskov algorithm to maximize the tube density of randomly distributed mixed carbon nanotube bundles (RMCBs) for configuring optimum performance of on‐chip interconnects. Optimizing tube density has proposed eight different RMCB (RMCB1–RMCB8) structures of a varying number of carbon nanotubes (CNTs), where RMCB1 has the maximum CNTs. Moreover, the ABCD technique adequately analyzes the temperature‐dependent frequency and stability characteristics of a three‐line RMCB interconnect placed on smooth and rough substrates (SiC, BN, and SiO2). The smooth substrate material has the best 3‐dB bandwidth compared with rough SiC substrate, followed by BN and SiO2 for all RMCB structures, and among all structures, the RMCB8 has the best 3‐dB bandwidth. The relative stability of RMCB1 is improved by 134.2% and 22.7% w.r.t. RMCB8 placed on a smooth and rough SiC substrate, respectively. Whereas bandwidth of the RMCB1 is reduced by 26% and 88.5% w.r.t. RMCB8 placed on a smooth and rough substrate, respectively. Hence, there is a tradeoff between the bandwidth and the relative stability as the number of CNT increases. Therefore, RMCB3 placed on a smooth substrate and RMCB4 placed on a rough SiC substrate are considered the best‐optimized RMCB interconnects to maintain a balance between the two.

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Modelling and analysis of crosstalk induced noise effects in bundle SWCNT interconnects and its impact on signal stability

et al. 2017

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Thermally aware performance analysis of single-walled carbon nanotube bundle as VLSI interconnects

Cited by 24 publications

References 35 publications

Temperature‐dependent modeling and performance analysis of coupled MLGNR interconnects

Temperature‐dependent modeling and performance analysis of coupled MLGNR interconnects

Structure optimization: Configuring optimum performance of randomly distributed mixed carbon nanotube bundle interconnects

Modelling and analysis of crosstalk induced noise effects in bundle SWCNT interconnects and its impact on signal stability

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