Thermally Conductive and Insulating Epoxy Composites by Synchronously Incorporating Si-sol Functionalized Glass Fibers and Boron Nitride Fillers

Zhang, Ruihan; Shi, Xuetao; Tang, Lin; Liu, Zheng; Zhang, Junliang; Guo, Yue; Gu, Junwei

doi:10.1007/s10118-020-2391-0

Cited by 120 publications

(49 citation statements)

References 52 publications

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“…BN possesses a hexagonal crystal structure and exhibits a layerlike structure with a high aspect ratio. Such morphology makes it difficult to obtain a uniform dispersion of BN grains in a composite material, and the resulting composite loaded with BN tends to have an anisotropic thermal conductivity owing to its high aspect ratio [11][12][13][14] . AlN and Si 3 N 4 are easily available commercially compared to BN.…”

mentioning

confidence: 99%

Improving the thermal conductivity of epoxy composites using a combustion-synthesized aggregated β-Si3N4 filler with randomly oriented grains

Shimamura

Hotta

Hyuga

et al. 2020

Sci Rep

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Electrically insulating and thermally conductive polymer matrix composites are desirable for industry applications as they improve the reliability of high-performance electronic devices, particularly via heat dissipation in devices loaded with several electronic components. In this study, an aggregated β-Si3N4 filler with randomly oriented grains was produced via combustion synthesis to improve the thermal conductivity of epoxy composites. The thermal conductivities of the prepared composites were investigated as a function of the filler content, and the values were compared to those of composites loaded with commercial β-Si3N4 (non-aggregated). Negligible difference was observed in the thermal conductivities of both types of composites when the Si3N4 content was below 40 vol%; however, above 40 vol%, the aggregated β-Si3N4 filler-loaded composites showed higher thermal conductivities than the commercial β-Si3N4-loaded composites. The aggregated β-Si3N4 filler-loaded composites exhibited isotropic thermal conductivities with a maximum value of 4.7 W m−1 K−1 at 53 vol% filler content, which is approximately 2.4 times higher than that of the commercial β-Si3N4-loaded composites, thereby suggesting that the morphology of the aggregated filler would be more efficient than that of the commonly used non-aggregated filler in enhancing the thermal conductivity of a polymer matrix composite.

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confidence: 99%

Improving the thermal conductivity of epoxy composites using a combustion-synthesized aggregated β-Si3N4 filler with randomly oriented grains

Shimamura

Hotta

Hyuga

et al. 2020

Sci Rep

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“…The first had a MWCNT content of 0.09 vol.% (just below the percolation state in corresponding monofiller composites [26]), and the following MnFe 2 O 4 concentrations: 0, 0.025, 0.05, 0.35, 0.65, 5, and 10 vol.%, while the second one had a higher MWCNT content of 0.58 vol.% (above percolation threshold) and 0, 0.025, and 0.58 vol.% of MnFe 2 O 4 . The volume concentrations were evaluated from weight concentrations considering that the density of epoxy resin was 1.16 g/cm 3 , MnFe 2 O 4 was 5.4 g/cm 3 , and MWCNT was 2 g/cm 3 .…”

Section: Methodsmentioning

confidence: 99%

“…Polymer composites with nanoinclusions are among the most prospective materials for investigations and applications due to the possibility of controlling and improving the macroscopic properties of polymers by the addition of a small amount of nanoparticles [1]. Epoxy resin, due to its attractive mechanical and thermal properties, is a very popular polymer matrix for composite preparation [2,3]. For the electrical properties of composites composed of conducting inclusions and an insulating matrix, the electrical percolation threshold (critical concentration) is the most important parameter [4].…”

Section: Introductionmentioning

confidence: 99%

Dielectric Relaxation in the Hybrid Epoxy/MWCNT/MnFe2O4 Composites

et al. 2020

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The electrical properties of epoxy/MWCNT (multi-walled carbon nanotubes)/MnFe2O4 hybrid composites loaded with MWCNTs (below, 0.09 vol.%, and above, 0.58 vol.%, percolation threshold) and varying concentrations of MnFe2O4 up to 10 vol.% were studied in a wide frequency range (20 Hz–40 GHz) at different temperatures (20 K–500 K). At low frequencies, the dielectric permittivity and the electrical conductivity of composites with fixed amounts of MWCNT are strongly dependent on MnFe2O4 content. For MWCNT concentrations above the percolation threshold (i.e., 0.58 vol.%), the electrical conductivity highly decreases with the increase of the MnFe2O4 fraction. In contrast, for the epoxy/MWCNT just below the onset of electrical conductivity (0.09 vol.% of MWCNTs), there exists an optimal concentration of MnFe2O4 inclusions (i.e., 0.025 vol.%), leading to a dramatic increase of the electrical conductivity by three orders of magnitude. The electrical transport in composites is mainly governed by electron tunneling at lower temperatures (below 200 K), and it is highly impacted by the matrix conductivity at higher temperatures (above 400 K). The electrical properties were discussed in terms of the Maxwell–Wagner relaxation and distributions of relaxation times. A non-invasive platform based on dielectric relaxation spectroscopy was proposed for enhancing the synergetic effect coursed by using multiple nanoinclusions in polymer composites just below the percolation threshold.

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“…Among ceramic fillers, h-BN has high TC, high chemical stability, large aspect ratio while possessing lowest dielectric constant among ceramic fillers (~4) and being a perfect electrical insulator (σ = 10 −11 S•cm −1 ) due to its large band gap. Therefore, all these merits turn h-BN into a promising candidate for utilization in electronic packaging materials [32,[47][48][49][50]. Since h-BN is regarded as an anisotropic filler with distinctive difference in its in-plane and out-of-plane TCs, the TC of the h-BN-reinforced polymer composite is also affected by filler's orientation, filler-filler and filler-polymer interfacial properties [51].…”

Section: Fabrication Of H-bn-reinforced Polymer-based Compositesmentioning

confidence: 99%

Recent Progress in the Study of Thermal Properties and Tribological Behaviors of Hexagonal Boron Nitride-Reinforced Composites

et al. 2020

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Ever-increasing significance of composite materials with high thermal conductivity, low thermal expansion coefficient and high optical bandgap over the last decade, have proved their indispensable roles in a wide range of applications. Hexagonal boron nitride (h-BN), a layered material having a high thermal conductivity along the planes and the band gap of 5.9 eV, has always been a promising candidate to provide superior heat transfer with minimal phonon scattering through the system. Hence, extensive researches have been devoted to improving the thermal conductivity of different matrices by using h-BN fillers. Apart from that, lubrication property of h-BN has also been extensively researched, demonstrating the effectivity of this layered structure in reduction of friction coefficient, increasing wear resistance and cost-effectivity of the process. Herein, an in-depth discussion of thermal and tribological properties of the reinforced composite by h-BN will be provided, focusing on the recent progress and future trends.

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Thermally Conductive and Insulating Epoxy Composites by Synchronously Incorporating Si-sol Functionalized Glass Fibers and Boron Nitride Fillers

Cited by 120 publications

References 52 publications

Improving the thermal conductivity of epoxy composites using a combustion-synthesized aggregated β-Si3N4 filler with randomly oriented grains

Improving the thermal conductivity of epoxy composites using a combustion-synthesized aggregated β-Si3N4 filler with randomly oriented grains

Dielectric Relaxation in the Hybrid Epoxy/MWCNT/MnFe2O4 Composites

Recent Progress in the Study of Thermal Properties and Tribological Behaviors of Hexagonal Boron Nitride-Reinforced Composites

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