Nano-Bio- Electronic, Photonic and MEMS Packaging 2009
DOI: 10.1007/978-1-4419-0040-1_10
|View full text |Cite
|
Sign up to set email alerts
|

Thermally Conductive Nanocomposites

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
2

Citation Types

2
23
0

Year Published

2012
2012
2020
2020

Publication Types

Select...
7
1

Relationship

0
8

Authors

Journals

citations
Cited by 15 publications
(25 citation statements)
references
References 91 publications
2
23
0
Order By: Relevance
“…Epoxy resin is one of typical polymer matrices, and SiC, Al 2 O 3 , BN have been widely adopted as thermally conducting fillers to cope with thermal management issues [10,11]. However, in order to achieve the satisfied thermal conductivity (1$5 W m À1 K À1 ), the loading fraction of the filler always exceeds 60 vol%, which leads to a high bulk density and poor mechanical properties [11][12][13][14].…”
Section: Introductionmentioning
confidence: 99%
“…Epoxy resin is one of typical polymer matrices, and SiC, Al 2 O 3 , BN have been widely adopted as thermally conducting fillers to cope with thermal management issues [10,11]. However, in order to achieve the satisfied thermal conductivity (1$5 W m À1 K À1 ), the loading fraction of the filler always exceeds 60 vol%, which leads to a high bulk density and poor mechanical properties [11][12][13][14].…”
Section: Introductionmentioning
confidence: 99%
“…However, pure polymers do not exhibit the required physical properties such as high thermal or electrical conductivity and they are usually classified as thermal and electrical insulators. So far, many studies have been carried out in order to improve these properties by incorporation of conductive particles, such as metal or ceramic particles [2,3] into polymer [4,5] matrix. Recently, much attention of leading research centers dealing with heat transport in thermally conductive composites has been focused on various fillers and methods of arrangement of their particles that could improve the thermal conductivity of polymeric formulae.…”
Section: Introductionmentioning
confidence: 99%
“…Thermal interface materials (TIMs), applied between heat sources and heat sinks, are essential ingredients of thermal management [2][3][4][5][6]. Conventional TIMs filled with thermally conductive particles require high volume fractions f of filler (f~50%) to achieve thermal conductivity K of the composite in the range of ~1-5 W/mK at room temperature (RT) [3][4][5][6]. Earlier attempts of utilizing highly thermally conductive nanomaterials, e.g.…”
mentioning
confidence: 99%
“…The drive to reduce L of the conventional fillers, e.g. metal particles, is explained by the fact that smaller L at high f results in larger particle-to-particle contact area and lower R TIM [6]. The efficiency of the filler in TIMs is characterized by the thermal conductivity enhancement (TCE) defined as…”
mentioning
confidence: 99%