“…Epoxy resin is one of typical polymer matrices, and SiC, Al 2 O 3 , BN have been widely adopted as thermally conducting fillers to cope with thermal management issues [10,11]. However, in order to achieve the satisfied thermal conductivity (1$5 W m À1 K À1 ), the loading fraction of the filler always exceeds 60 vol%, which leads to a high bulk density and poor mechanical properties [11][12][13][14].…”