2018
DOI: 10.1002/adem.201800411
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Thermally Controlled Adhesive Curing during the Production of Piezo‐Metal‐Compounds: Finite Element Modeling and Analyses

Abstract: In this paper, finite element (FE) analyses of the production process of piezo‐metal‐compounds are considered. The compounds consist of two adhesively bonded metal sheets with embedded actuator/sensor patches. During the production process, the patches are placed inside an uncured adhesive layer and the prepared compound is formed to its final shape, while the uncured adhesive serves as a floating support and protects the actuator/sensor patch. Only after forming, the adhesive is fully cured in order to achiev… Show more

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Cited by 7 publications
(5 citation statements)
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“…Moreover, further investigations are necessary regarding the impact of the thickness and the thermal properties of the MDS cover layers on the heating curves inside rubber samples of different shape. In this regard, numerical simulations, like, e.g., the applied in [ 35 ], can help to determine the necessary heating strategies required for the vulcanization of the embedded rubber samples.…”
Section: Resultsmentioning
confidence: 99%
“…Moreover, further investigations are necessary regarding the impact of the thickness and the thermal properties of the MDS cover layers on the heating curves inside rubber samples of different shape. In this regard, numerical simulations, like, e.g., the applied in [ 35 ], can help to determine the necessary heating strategies required for the vulcanization of the embedded rubber samples.…”
Section: Resultsmentioning
confidence: 99%
“…The method is promising for mechanobiology and mechanics of composite materials. The implemented plasticity model can be useful for the prediction of residual stresses caused by chemical curing [25,16,14]. The more accurate simulation of residual stresses allows for a rational analysis of deformation and damage in prestressed structures.…”
Section: Conclusion and Discussionmentioning
confidence: 99%
“…The limitation of the maximum attainable degree of cure can also be described by an additional diffusion factor. For this, Fournier et al [29] made a significant contribution which has been applied in various recent studies for epoxy resins, see [30], [31] and [32].…”
Section: Discussionmentioning
confidence: 99%