2018
DOI: 10.1016/j.compstruct.2017.02.014
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Thermally induced multistable configurations of variable stiffness composite plates: Semi-analytical and finite element investigation

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Cited by 71 publications
(18 citation statements)
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“…Recently, the thermal buckling behaviour of variable-stiffness plates was investigated in [36], using a thin-plate finite element formulation, and [37], by considering FSDT. Thermally induced multi-stable configurations were assessed by Haldar et al [38] using finite elements and the Ritz approach proposed by Dano and Hyer [39].…”
Section: Introductionmentioning
confidence: 99%
“…Recently, the thermal buckling behaviour of variable-stiffness plates was investigated in [36], using a thin-plate finite element formulation, and [37], by considering FSDT. Thermally induced multi-stable configurations were assessed by Haldar et al [38] using finite elements and the Ritz approach proposed by Dano and Hyer [39].…”
Section: Introductionmentioning
confidence: 99%
“…There was a lot of work done in the literature on the unsymmetric bistable plates in its individual form, but one of the significant gap identified was the study on the factors affecting the required snap‐through and snap‐back loads for different deflections of these laminates. So far in literature, the shapes of laminates that have been studied were either rectangle or square 13–15 . In this study, the behaviour of triangular shape laminates and the actuation force required for the snap through will be identified.…”
Section: Introductionmentioning
confidence: 99%
“…The methods to produce multistable shells have received great attention and are well documented in the literature [1], in which thermal stress-based bistable shells [2,3] and prestress-based bistable shells [4][5][6] are found to be the most common bistable components. Since 1981, ever since Hyer reported [2] the bistable cured shapes of unsymmetrical laminates, extensive works on bistable laminates have been published, especially on the prediction of cured shapes of bistable using analytical approaches [7][8][9][10], and the robust simulation of the snap-through process by finite element analyses [11][12][13][14][15].…”
Section: Introductionmentioning
confidence: 99%