2020
DOI: 10.1039/d0tc02110e
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Thermally stable indium based metal–organic frameworks with high dielectric permittivity

Abstract: Two thermally stable In-based MOFs exhibit high dielectric behavior with wide bandgaps.

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Cited by 14 publications
(8 citation statements)
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“…The dielectric constant of MFM-722(Pb) is higher than that of HKUST-1 (1.74 at 100 kHz), 27 but is lower than that of an In-btc (btc 3À = 1,2,3benzenetricarboxylate) based MOF (28.0 at 100 kHz). 28…”
mentioning
confidence: 99%
“…The dielectric constant of MFM-722(Pb) is higher than that of HKUST-1 (1.74 at 100 kHz), 27 but is lower than that of an In-btc (btc 3À = 1,2,3benzenetricarboxylate) based MOF (28.0 at 100 kHz). 28…”
mentioning
confidence: 99%
“…[19,20] In addition to the electronic energy levels, dielectric permittivity is another key parameter of 2D molecular crystals, which is closely related to properties such as exciton binding energy, conductivity, capacitance, and so on. [21][22][23] The application of low dielectric permittivity (k < 2.4) materials will reduce parasitic capacitance, thereby achieving faster gate operation and minimizing dynamic power consumption. [24,25] Meanwhile, the realization of high dielectric permittivity materials in nanointegrated circuits also provides new possibilities for sensing, electronic capacitors, and high power density energy storage devices.…”
Section: Doi: 101002/smtd202101198mentioning
confidence: 99%
“…1,2 Semiconductor industry associations have identified the need to develop low-κ (κ < 2.4) materials as an interlayer dielectric (ILD) to address this challenge. [3][4][5][6][7][8] Methods of reducing the dielectric constant of materials can be divided into two main methods: (1) reducing the density of materials by introducing a porous structure into the material; [9][10][11][12] (2) reducing the polarizability of materials, generally by introducing lower polarizability bonds. [13][14][15][16][17] Conventional applications in interlayer materials are inorganic materials and organic polymer-based low-κ materials.…”
Section: Introductionmentioning
confidence: 99%