Thermo-compression bonding of alumina ceramics to metal

Das, Subrata; Tiwari, Ashutosh; Kulkarni, Ajit R.

doi:10.1023/b:jmsc.0000026935.18466.4b

Cited by 13 publications

(8 citation statements)

References 4 publications

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“…Various ceramic-to-metal joining techniques, utilizing or not a liquid phase, have been developed and improved over the past 60 years, among which solid-state diffusion bonding [2][3][4][5][6][7] and reactive metal brazing [2,5,[7][8][9][10]. Both processes are widely used, especially because strong and gas proof bonds can be obtained.…”

Section: Introductionmentioning

confidence: 99%

Effect of thermal residual stresses on the strength for both alumina/Ni/alumina and alumina/Ni/nickel alloy bimaterials

et al. 2009

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International audienceThis paper describes some technical limitations encountered in joining ceramics-ceramics or ceramics-metals, and how, to some extent, they have been practically overcome. The effect of the residual stresses on the strength of joints fabricated between alumina-alumina or alumina and the nickel base alloy HAYNES 214TM using a solid-state bonding technique with Ni interlayer was studied. Finite element analyses (FEA) for the elastic-plastic and elastic-plastic-creep behavior have also been used to better design the joints and to predict their performance. It was found that the residual stresses caused by the thermal expansion mismatch between alumina (Al2O3) and the Ni-based superalloy (HAYNES 214TM) have severely deteriorated the joints compared to Al2O3-Al2O3 joint fabricated with the same solid-state bonding parameters. The high residual stresses zones obtained through the FEA simulation fitted well with the fractographic observations of the Al2O3/Ni/HAYNES 214TM joints. Also, in order to use the joint material as a structural material, the study about the effect of geometrical parameters has been performed. Optimal geometries have been determined

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Section: Introductionmentioning

confidence: 99%

Effect of thermal residual stresses on the strength for both alumina/Ni/alumina and alumina/Ni/nickel alloy bimaterials

et al. 2009

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“…The applied force includes the weight of MACRO core. The 6.89 MPa pressure is 10 times lower than what has been used in industrial thermo-compression bonding processes [26,27]. The assembly is taken out of the bonding chamber after natural cooling in 1.33 9 10 -5 MPa vacuum.…”

Section: Experimental Designs and Proceduresmentioning

confidence: 99%

A solid-state bonding technique of large copper wires for high power devices operating at high temperature

Lee

2015

J Mater Sci: Mater Electron

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Solid-state processes of bonding 1 mm copper (Cu) wires on Cu substrates and silicon (Si) chips, respectively, were developed. To overcome Cu oxidation issue, the bonding surface on the wire was plated a silver (Ag) layer. An annealing step followed to make the Ag layer much easier to deform and conform to the Cu or Si bonding surfaces. The bonding process was performed at 300°C with 6.89 MPa. Wire-bond cross sections were studied using optical and electron microscopy, respectively. The images obtained exhibit nearly perfect Ag-Cu bonding interface. For wire-bonds made on Cu substrate, in-plane (shear) pull test measured a breaking of force 20.7-23.7 kg, comparable to the 22.5 kg breaking force of the Cu wire itself. Breaking forces on vertical (peel) pull test are about one-half of in-plane pull test results. For wire-bonds made on Si chip, breaking forces are about 80 % of those made on Cu substrate. Fracture modes were evaluated in details. 90 % of the wire-bonds broke with three modes mixed together: near Cu-Ag plating interface, inside Ag layer, and Ag-Cu bonding interface. Thus, the bonding interface is as strong as other regions of the wirebond. This solid-state wire bonding process is expected to have valuable applications in high power and high temperature devices and modules where the wire-bonds have to stand alone without protection due to lack of high temperature molding compound and reinforcing materials.

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“…Tsau et al (19) have tested effects of various pressure (30-120 MPa), temperatures (260 and 300 C), and time (2-90 min) on the bond toughness. Das et al (21) developed a thermocompression bonding method for alumina ceramics and Kovar (nickel-cobalt ferrous alloy composition, FerNiCo1) using aluminum interlayers. He et al (20) have studied an intermetallic chemical compound (titanium aluminide, TiAl) and steel diffusion bonding method using composite barrier layers of titanium/vanadium/copper.…”

Section: Thermocompression Bondingmentioning

confidence: 99%

“…Tang et al (15) Cu-Cu Cu-Cu wafer surface through interdiffusion of Cu atoms Made et al (14) Cu-Cu Analytical model to optimize the quality of bonding method Fan et al (13) Cu-Cu Various bonding temperatures have been investigated Tsau et al (17), Spearing et al (18) Au-Au Analysis of finite elements and a cohesive zone model for nonideal load displacement in wafer bonding Tsau et al (19) Au-Au Analysis of effects of various pressure, temperature, and time parameters on toughness of bonds Jang et al (22) Cu-Cu Higher adhesive energy in lower temperatures, using postannealing in N 2 for 1 h Chen et al (16) Cu-Cu Investigation on effects of various temperatures and bonding duration on the quality of bonds Zhou et al (23) W-W First applicable bonding process for tungsten to tungsten wafers He et al (20) TiAl-steel Discussion on the relationship of the bond parameters and tensile strength of the joints; Determination of the optimum bond parameters Das et al (21) Alumina-Kovar Investigation on the effects of time duration and pressure on the bonding strength postbond annealing at temperatures below 400 C can be achieved through optimization of process conditions. Moreover, the wafer-to-wafer nonthermocompression bonding allows high throughput (up to 14 wafers per hour).…”

Section: Reference Materials Main Achievementmentioning

confidence: 99%