Thermo-curable and photo-patternable polysiloxanes and polycarbosiloxanes by a facile Piers–Rubinsztajn polycondensation and post-modification

Fan, Wenhui; Hong, Nianmin; Sun, Quan; Li, Menglu; Fu, Wenxin

doi:10.1039/d2py00234e

Cited by 20 publications

(16 citation statements)

References 41 publications

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“…As exhibited in Figure a, E-BCB , E-Si-BCB , and an equimolar mixture of E-Si-BCB and HEP display wide exothermic peaks, which have a similar onset curing temperature ( T onset ) of nearly 180 °C and the maximum exothermic peak temperature ( T peak ) of nearly 250 °C at first scan. These data are consistent with those of most reported BCB monomers. − It is noted that no obvious exothermic peak is observed at the second scan of DSC (Figure a), indicating that all monomers have completely transformed into P1–P3 . FT-IR spectroscopy was employed to further investigate the thermal crosslinking reaction of monomers, and the results are displayed in Figure S3.…”

Section: Resultssupporting

confidence: 90%

Cyclotriphophazene-Centered Six-Arm Eugenol-Linked Low-Dielectric Materials with High Thermostability and Transparency

Fang

Feng

et al. 2022

ACS Sustainable Chem. Eng.

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Two silicon-containing eugenol-based benzocyclobutene monomers were prepared by a simple solvent-free hydrosilylation reaction. After heat treatment, a series of materials were obtained by a free radical addition reaction, [4 + 4] cycloaddition, or [4 + 2] Diels–Alder cycloaddition. All polymers displayed high thermostability with a 5% weight loss temperature (T 5d) of over 410 °C and a glass transition temperature (T g) of up to 216 °C as well as a good transmittance of 90% varying from 500 to 800 nm. In particular, all polymers also exhibited good hydrophobicity with contact angles exceeding 100° and water absorption as low as 8‰ after immersing in boiling water for 72 h. It should be noted that P3 showed excellent dielectric properties with a dielectric constant (D k) of 2.48 and a dielectric loss (D f) of 6.38 × 10–3 at a high frequency of 2 GHz as well as good flame retardancy due to the high content of cyclotriphophazene compared with those of P1, P2, and previously reported biobased materials. The above advantages indicate that eugenol-based low-dielectric materials have great potential for application in encapsulation resins in the field of microelectronics.

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Section: Resultssupporting

confidence: 90%

Cyclotriphophazene-Centered Six-Arm Eugenol-Linked Low-Dielectric Materials with High Thermostability and Transparency

Fang

Feng

et al. 2022

ACS Sustainable Chem. Eng.

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“…The crosslinking reactions of BCB, as well as the rigid molecular structures, contributed to the high heat resistance. The T g , T d,5% and char yields of the cured resins from amorphous precursors were comparable to those of BCB-functionalized resins 27,49 and guaranteed their high working temperatures as high-performance polymers.…”

Section: Investigation On the Thermal And Mechanical Properties Of Th...mentioning

confidence: 66%

“…Unfortunately, all the T m of crystalline precursors exceeded 200 1C, which is commonly considered as the starting temperature of BCB ring-opening reaction, 27,49 indicating immediate BCB reactions after the crystals melting. Hence, the molten small molecules were unstable and tend to self-crosslink quickly, especially for those who possess T m above 220 1C.…”

Section: Evaluation Of the Crystallinity And Thermal Properties Of Bi...mentioning

confidence: 99%

“…[22][23][24] Compared with polymers, precursors with low molecular mass flow more easily owing to the weak molecular interactions, which can be enhanced by post-crosslinking after molding. Accordingly, many precursors with crosslinkable groups, including benzocyclobutene (BCB), [25][26][27][28] trifluorovinyl-ether 29,30 and phenylethynyl groups 31,32 were prepared as small molecules or oligomers. For example, Fang et al 29 synthesized two resveratrol-based monomers containing three trifluorovinyl-ether groups, which behaved as low-viscosity liquids at room temperature, and crosslinked at elevated temperatures to give cured resins with T d,5% above 450 1C.…”

Section: Introductionmentioning

confidence: 99%

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Design and preparation of glassy molecular precursors by adjusting molecular structures for facile processing of high-performance polymers

Feng

Sun

Wang

2022

Mater. Chem. Front.

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“…27 To increase the thermal stability of the porous structurebased low-dielectric-constant materials, diverse polymers with excellent thermal properties have been employed. [28][29][30][31] Among them, PIs were usually known as the "problem solver" due to their low dielectric constant, excellent thermal resistance, and mechanical properties induced by their conjugated and rigid backbones that contain a large number of nitrogen heterocycles and benzene rings, along with the strong intermolecular and intramolecular interactions. [32][33][34][35][36] For example, a PI aerogel was prepared by imidizing biphenyl-tetracarboxylic acid dianhydride, and 4,4 0 -oxydianiline.…”

Section: Introductionmentioning

confidence: 99%

A promising low‐dielectric‐constant material with good comprehensive performance upon heating

Han

2023

J of Applied Polymer Sci

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The dielectric and other properties of low‐dielectric‐constant materials after heating are crucial to their performance and use, but rarely studied. In this article, sandwich‐type porous polyimide (PI) film in which porous structures located on both upper and lower surfaces of flat PI film was prepared through the simple, low‐cost and green microemulsion method. The porous structures were preserved after heating due to the usage of thermally stable fluorine‐contained PI (FPI) and PI as skeleton and substrate of the porous structure, respectively, but with the increase of pore size because of the removal of thermally unstable surfactant on the inner surface of the pores. More importantly, 2.89%–5.57% of reductions in the dielectric constant with the maintenance of low dielectric loss and water absorption and high mechanical strength were observed after heating. Therefore, the low dielectric properties of heated films were well preserved upon high humidity treatment. Moreover, the structure and properties of the heated films could be adjusted via controlling the parameters in the microemuslion method. These excellent properties after the high‐temperature treatment facilitate the application of the sandwich‐type porous PI film as dielectric materials in high‐temperature environment.

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Thermo-curable and photo-patternable polysiloxanes and polycarbosiloxanes by a facile Piers–Rubinsztajn polycondensation and post-modification

Abstract: With the rapid development of integrated circuit (IC) chips towards nanometric miniaturization, advanced integration and high performance, the interlayer dielectric (ILD) material is playing an increasingly important role to meet...

Cited by 20 publications

References 41 publications

Cyclotriphophazene-Centered Six-Arm Eugenol-Linked Low-Dielectric Materials with High Thermostability and Transparency

Cyclotriphophazene-Centered Six-Arm Eugenol-Linked Low-Dielectric Materials with High Thermostability and Transparency

Design and preparation of glassy molecular precursors by adjusting molecular structures for facile processing of high-performance polymers

A promising low‐dielectric‐constant material with good comprehensive performance upon heating

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