Thermo-Hygroscopic-Mechanical Coupling Simulation Method for Power Electronics Under Power Cycling Test

Wang, Yanhao; Deng, Erping; Wu, Tianhua; Zhang, Yiming; Xie, Luhong; Huang, Yuehui

doi:10.1109/tpel.2023.3290749

Cited by 3 publications

(1 citation statement)

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“…Nevertheless, the work mentioned above shares a limitation: the influence of humid air on the device was not considered. Given that devices can work on rainy or windy days, the fluid field composed of the surrounding humid air also couples with the thermal field, acting together on electronic devices [17][18][19]. Therefore, it is essential to consider the coupling effects of electromagnetics, heat, and humid air to contribute to improving the accuracy of modeling and simulation for the entire system.…”

Section: Introductionmentioning

confidence: 99%

A Surrogate Model for the Rapid Evaluation of Electromagnetic-Thermal Effects under Humid Air Conditions

Zhu,

Wang,

Zhang

et al. 2024

Electronics

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Integrated circuits are being more and more extensively applied, and the reliability issues of devices are receiving increased attention from researchers. The study of electronic device performance is not limited to the device themselves; these studies also need to consider the operating environment, such as high temperature or high humidity, which requires fluid simulation. However, this approach inevitably increases the complexity of modeling and the difficulty of the equations to be solved. Aiming at the simulation of the thermal performance of a device under coupled humid air conditions, this paper proposes a surrogate model to quickly evaluate the multiphysical effects of humid air and a multiphysical solver based on it. In this research, the finite element method (FEM) is utilized to simulate the multiphysical problem, and the proposed method is verified as being efficient.

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Section: Introductionmentioning

confidence: 99%