Thermo–Kinetic diagrams: The Cu–H2O–Acetate and the Cu-H2O systems

Deen, Kashif Mairaj; Mehrjoo, Nasrin; Asselin, Edouard

doi:10.1016/j.jelechem.2021.115467

Cited by 18 publications

(6 citation statements)

References 25 publications

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“…41 Stability of slurry.-Nicomp 380 DLS laser nanoparticle analyzer (produced by PSS company in the United States) and AccuSizer 780 APS large particle tester (produced by PSS company in the United States) were used to test the average particle size and Zeta potential of the slurry. 42…”

Section: Methodsmentioning

confidence: 99%

Effect of Novel pH Regulators on Copper film Chemical Mechanical Polishing for Ruthenium-Based Copper Interconnect under Weak Alkalinity Conditions

Dong,

Niu,

Liu

et al. 2024

ECS J. Solid State Sci. Technol.

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For Ruthenium (Ru)-based copper (Cu) interconnects Cu film chemical mechanical polishing (CMP), it is crucial to select appropriate pH regulators in the slurry to ensure the chemical reactions and maintain the stability of the polishing chemical environment. In this study, the effects of inorganic pH regulator KOH, organic pH regulator diethanolamine (DEA), and 2-amino-2-methyl-1-propanol (AMP) on CMP and slurry properties of Cu film were compared. It was found when using AMP as a pH regulator, the Cu/Ru removal rate selectivity (RRS) can reach 598:1, the surface roughness of Cu film decreased to 0.76 nm, and the slurry can remain stable for at least 7 days. The performance order of the three pH regulators is AMP＞KOH＞DEA. Meanwhile, through experimental results and test analysis, it has been confirmed that AMP can also play a multifunctional role as a complexing agent, dispersant, and surfactant. Therefore, AMP can replace KOH as a new pH regulator in weak alkaline slurries. This result plays an important role in guiding the selection of organic pH regulators in the optimization of Cu film CMP slurry.

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Section: Methodsmentioning

confidence: 99%

Effect of Novel pH Regulators on Copper film Chemical Mechanical Polishing for Ruthenium-Based Copper Interconnect under Weak Alkalinity Conditions

Dong,

Niu,

Liu

et al. 2024

ECS J. Solid State Sci. Technol.

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“…However, in neutral or alkaline environments, passivation films such as CuO and Co 3 O 4 will be produced on the Cu and Co surface respectively. 22,23 Therefore, potassium hydroxide (KOH) was used to adjust the pH of slurry to 10. 0.5 wt% silica sol was selected as the abrasive.…”

Section: Methodsmentioning

confidence: 99%

Inhibition Effect and Mechanism of 2-Mercaptopyrimidine on Cobalt-Based Copper Interconnects Chemical Mechanical Polishing: Combined Experimental and DFT Study

Liu,

Niu,

Zhan

et al. 2023

J. Electrochem. Soc.

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Cobalt has been determined as a suitable barrier layer material for integrated circuits as the feature size continuous reduction to 14 nm. To protect the copper and cobalt surfaces from corrosion and obtain high copper and cobalt removal rate selectivity during cobalt-based copper interconnects chemical mechanical polishing process, selecting appropriate inhibitor in slurry is critical. In this paper, the inhibition effect and mechanism of 2-mercaptopyrimidine on copper/cobalt surfaces are studied combined experiments and density functional theory calculation. Experiments results reveal that 2-MP could increases the selectivity to 110.4, forms dense passivation film on the copper and cobalt surface to inhibits corrosion with high efficiency of 98% and 92%, and obtain ideal surface quality. Calculation results prove that the N-p and S-p orbitals of inhibitors hybridize with copper-d and cobalt-d orbital to form chemical bonds, adsorbing on metals surface vertically and parallelly. The mixed adsorption modes lead to form complete and dense passivation film. Such study provides better perspective into comprehending the corrosion protection of metal surfaces at the atomic level and clarifies the inhibition mechanism at the interface of metal-organic compounds.

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“…Constructing the E-pH diagrams of the constitutive elements of an alloy can inform about the possibility of corrosion [9][10][11]. E-pH diagrams demonstrate the regions for thermodynamically stable reaction products of a given element as a function of the solution pH and electrode potential, in order to distinguish the conditions for immunity, active corrosion, and passivity [12,13]. To predict corrosion in the CANDU SG system, two effects should be considered in constructing E-pH diagrams: (i) effect of the HTHP conditions on the possible reactions and (ii) effect of the presence of organic substances or impurities on the chemistry of the environment.…”

Section: Introductionmentioning

confidence: 99%

Nickel-based alloy corrosion in CANDU steam generators: E-pH diagrams of the Ni-NH3-H2O and Ni-CH3COO−-H2O ternary systems

Khollari¹,

Zebardast

Asselin

2023

Preprint

Self Cite

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Nuclear power plant steam generator (SG) tubes contain nickel as the main alloying element and there is concern about their corrosion. We optimized models for calculating the high-temperature and high-pressure thermodynamic properties of common nuclear alloy elements and then, calculated the E-pH diagrams for nickel in different concentrations of ammonia or acetate ion between 100 to 260 ℃ at 4.7 MPa. This information is used to predict the corrosion behaviour for nickel in the secondary circuit conditions of CANDU SGs. Based on the results, nickel ammonia and nickel acetate complexes are not stable at low concentrations of ammonia or acetate ion. However, increasing the ammonia or acetate ion concentration resulted in the predominance of Ni(NH3)n2+ or Ni(Ac)n(2−n) at the expense of Ni2+ and NiO, indicating a higher risk of nickel corrosion. Calculations showed that under normal operating conditions with [NH3]tot=5×10−5 and [CH3COO−]tot=10−8 m at 260 ℃ and 4.7 MPa, nickel will be passivated as NiO, preventing the rapid degradation of nickel-based alloys. However, in the presence of a crevice that allows the acetate ion to concentrate, nickel would dissolve in the form of the Ni2+ ion, endangering safe operation of CANDU SGs.

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Thermo–Kinetic diagrams: The Cu–H2O–Acetate and the Cu-H2O systems

Cited by 18 publications

References 25 publications

Effect of Novel pH Regulators on Copper film Chemical Mechanical Polishing for Ruthenium-Based Copper Interconnect under Weak Alkalinity Conditions

Effect of Novel pH Regulators on Copper film Chemical Mechanical Polishing for Ruthenium-Based Copper Interconnect under Weak Alkalinity Conditions

Inhibition Effect and Mechanism of 2-Mercaptopyrimidine on Cobalt-Based Copper Interconnects Chemical Mechanical Polishing: Combined Experimental and DFT Study

Nickel-based alloy corrosion in CANDU steam generators: E-pH diagrams of the Ni-NH3-H2O and Ni-CH3COO−-H2O ternary systems

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