Thermo-mechanical analysis of a multilayer hollow cylindrical thermal protection structure with functionally graded ultrahigh-temperature ceramic to be heat resistant layer

Dai, Ting; Li, Bin; Chen, Tao; He, Zhen-zhuo; Huang, Jen‐How

doi:10.1016/j.ast.2022.107532

Cited by 18 publications

(8 citation statements)

References 41 publications

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“…Note that, in case II the classical method of piecewise cubic Hermite interpolation polynomial is used to achieve ρ ( T , t ) and λ ( T , t ) based on the data of Figure 6(c) and 6(d). The fitting curves of temperature dependent thermal conductivities in Table 3 are (Dai et al , 2022): …”

Section: Numerical Results and Discussionmentioning

confidence: 99%

“…For the whole structure, a thermal boundary condition considering dynamic heat flux q w ¼ q w (t) and thermal radiation will be applied to the outer surface of the ceramic composite layer, while a boundary condition of heat exchange will be applied to the inner surface of the metal layer. That is (Dai et al, 2022;Bergman et al, 2011):…”

Section: Heat Conduction Problem Of Thermal Protection System and Num...mentioning

confidence: 99%

“…For the whole structure, a thermal boundary condition considering dynamic heat flux q w = q w ( t ) and thermal radiation will be applied to the outer surface of the ceramic composite layer, while a boundary condition of heat exchange will be applied to the inner surface of the metal layer. That is (Dai et al , 2022; Bergman et al , 2011): where h e is the heat exchange coefficient, ε 0 is the rate of thermal radiation, σ 0 is the Boltzmann constant, T ∞ is the environment temperature far away outside the cabin, and T in is the temperature inside the cabin which may maintain by phase-change materials.…”

Section: Heat Conduction Problem Of Thermal Protection System and Num...mentioning

confidence: 99%

“…Ignoring the adhesive materials between each layer and supposing perfect bonding interfaces without thermal resistance, the thermal continuity conditions between each layer can be written as (Dai et al , 2022; Bergman et al , 2011): …”

Section: Heat Conduction Problem Of Thermal Protection System and Num...mentioning

confidence: 99%

“…For a hypersonic flight vehicle (HFV), the thermal protection system (TPS) is such important as it protects the main structure of the HFV from being destroyed by harsh thermal environment, especially for the HFVs of long endurance (Liang et al , 2023). Among the various types of TPSs (Sziroczak and Smith, 2016; Uyanna and Najafi, 2020; Brodzik, 2021; Le et al , 2021), the simplest and most classical one is a multilayer structure composed of a heat resistant layer and a thermal insulation layer fixed over the main metal structure of the flight vehicle (Dai et al , 2022). For this kind of TPS, the ability to prevent heat transfer is determined by the material used for the thermal insulation layer.…”

Section: Introductionmentioning

confidence: 99%

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Thermal conductivity prediction of aerogel considering heat treatment effect and the application to a TPS of long endurance HFVs

Dai,

Tao

2023

HFF

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Purpose For a thermal protection system (TPS) of long endurance hypersonic flight vehicle (HFV), its thermal insulation property not only determines by the manufactured morphology but also changes along time. A thermal conductivity prediction model for aerogel considering heat treatment effect is carried out and applied to solve the heat conduction problem of a TPS. The aim of this study is to provide theoretical and numerical references for further development of aerogels applying to TPSs. Design/methodology/approach A thermal conductivity prediction model for aerogel is established considering treatment effect. The heat conduction problem of a TPS is derived and solved by combining the differential quadrature method and the Runge–Kutta method. The prediction results of aerogel thermal conductivities are verified by comparing with those in literature, while the calculated temperature field of TPS is verified by comparing with that by ABAQUS. Findings Numerical results show that when applying the current prediction model, the calculated high temperature area in the aerogel layer is narrowed due to the decrease of the thermal conductivity during heat treatment process. Originality/value This study will be beneficial to carry out the precise design of TPS for long endurance HFVs.

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Section: Numerical Results and Discussionmentioning

confidence: 99%

Section: Heat Conduction Problem Of Thermal Protection System and Num...mentioning

confidence: 99%

Section: Heat Conduction Problem Of Thermal Protection System and Num...mentioning

confidence: 99%

Section: Heat Conduction Problem Of Thermal Protection System and Num...mentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Thermal conductivity prediction of aerogel considering heat treatment effect and the application to a TPS of long endurance HFVs

Dai,

Tao

2023

HFF

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Creep analysis in a rotating variable thickness functionally graded disc with convection heat transfer and heat source

Saadatfar

Babazadeh

Babaelahi

2023

Mech Time-Depend Mater

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Thermal Stress Analysis for Functionally Graded Plates with Modulus Gradation, Part II

Baytak,

Tosun,

Ipek

et al. 2024

Exp Mech

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Background The gradation of thermal expansion coefficient was analyzed in the earlier study. The analytical formulation derived here, which is quite different, should be validated to understand the thermal stress distribution in a laminated composite and functionally graded material. Besides this solution, a validated numerical model can also be used to optimize the material gradation of plates in terms of sustainability. Objective To validate the analytical formulation derived here, an experimental model is presented to understand the thermal stress concentration for functionally graded and laminated composite plates. A numerical model is also validated to extend to understand the effects of the number of layers, the thickness of a layer, the gradation function, the ratio of elastic moduli, and the coating. Methods The experimental problems in the production of the experimental models with layers of different elastic moduli are discussed here. In the experimental analysis, a three-dimensional photoelastic stress analysis of two- and four-layer composite plate was used to mechanically model the thermal expansion. The analytical solution for the thermal stress in a free plate was derived by the strain suppression method based on the principle of superposition. The numerical models were analyzed using finite element software. The step variation in the experiment was used as a reference point for a continuous or multi-layer (> 2) step variation of material coefficients in the models. Results The variation of stress concentration is shown for various cases of laminated and continuous gradations of elastic modulus. The four-layer experimental model provides the difference in thermal stress distribution as a result of a layered coating. The validated analytical and numerical models provide reasonable results. An empirical formula to optimize the material gradation in terms of elastic modulus is derived. Conclusions The experimental model can be used to analyze thermal stress in functionally graded materials. The gradations of the material in the plate or the coating of the plates can be optimized by the validated analytical and numerical models. The empirical formula can be used to determine the elastic modulus of the coating to minimize the stress concentration.

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Thermo-mechanical analysis of a multilayer hollow cylindrical thermal protection structure with functionally graded ultrahigh-temperature ceramic to be heat resistant layer

Cited by 18 publications

References 41 publications

Thermal conductivity prediction of aerogel considering heat treatment effect and the application to a TPS of long endurance HFVs

Thermal conductivity prediction of aerogel considering heat treatment effect and the application to a TPS of long endurance HFVs

Creep analysis in a rotating variable thickness functionally graded disc with convection heat transfer and heat source

Thermal Stress Analysis for Functionally Graded Plates with Modulus Gradation, Part II

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