Thermo-Mechanical Behaviour of Copper-Ribbon Materials

Wiese, S.; Krämer, F. W.; Meier, Rico

doi:10.4229/24theupvsec2009-4av.3.39

24th European Photovoltaic Solar Energy Conference 2009

DOI: 10.4229/24theupvsec2009-4av.3.39

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Thermo-Mechanical Behaviour of Copper-Ribbon Materials

S. Wiese¹,

F. W. Krämer²,

Rico Meier³

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Cited by 4 publications

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Deformation analysis of wire bonding on soft polymers

Kraemer

Ritter

Wiese

et al. 2013

2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and

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The paper describes a three-dimensional, dynamic finite element simulation of a wire bonding process on a soft polymeric substrate (PTFE). Wire bonding between the chip and the substrate can be used to improve the interface performance in multi-GHz applications and provides high quality inductors for inductive peaking. For such high speed applications special high frequency substrates are required, such as PTFE. Wire bonding on those substrates is not easy, because they are very soft. Thus, such substrates can absorb a lot of the ultrasonic energy that is needed for the welding of wire and metallization.The simulations presented here compare the mechanical stresses generated on two pad geometries of this high frequency setup. These geometries represent a ground pad and signal pad structure. The results of the explicit dynamic simulations show little differences in the mechanical stresses generated during the initial compression of the bond wire. The contact force on the bond pads, the substrate penetration and the fmal bond wire diameter show little differences. But in all cases the ground pad structure causes slightly higher mechanical loads. Some noticeable differences can be found in case of the mechanical stresses caused in the bond pads. However, if serious problems appear during the wedge bonding on PTFE substrates, these issues cannot be solved by the little reinforcement of the ground pads by the copper clamp.

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Deformation analysis of wire bonding on soft polymers

Kraemer

Ritter

Wiese

et al. 2013

2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and

Self Cite

View full text Add to dashboard Cite

show abstract

FEM wire bonding simulation for sensor chip applications

Kraemer

Wiese

2014

2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and

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Stress analysis of silicon wafer based photovoltaic modules in operation

Lee

Tay

2012

2012 38th IEEE Photovoltaic Specialists Conference

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One cause of failure in PV modules is delamination in the interfaces. After lamination, when layers of PV materials are bonded together at about 145 °C and subsequently cooled down, residual stresses are induced due to the mismatch in coefficients of thermal expansion (CTE). When the PV laminate is subsequently framed and exposed to sunlight, the temperature distribution induced in the module will redistribute the residual stresses. The main objective of this paper is to employ finite element analysis to determine the stress distribution induced in the PV module during operation. Differences in stresses developed in modules with float glass covers and those with tempered glass covers were determined.

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Thermo-Mechanical Behaviour of Copper-Ribbon Materials

Cited by 4 publications

References 0 publications

Deformation analysis of wire bonding on soft polymers

Deformation analysis of wire bonding on soft polymers

FEM wire bonding simulation for sensor chip applications

Stress analysis of silicon wafer based photovoltaic modules in operation

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