Thermocompression Bonding Process Design and Optimization for Warpage Mitigation of Ultra-Thin Low-CTE Package Assemblies

Jayaram, Vidya; McCann, Scott; Huang, Tien‐Chi; Kawamoto, Satomi; Pulugurtha, Raj; Smet, Vanessa; Tummala, Rao

doi:10.1109/ectc.2016.384

Cited by 14 publications

(1 citation statement)

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“…The uneven surfaces go against the precise control of the interelectrode spacing of the APDT, which is essential to achieve a high sensitivity for the displacement transducer, as demonstrated in our previous works [10,11]. In addition, the bonding-induced stress may damage the device or affect the long-term stability due to slow-releasing of the stress [12][13][14].…”

Section: Introductionmentioning

confidence: 97%

Temperature Gradient Method for Alleviating Bonding-Induced Warpage in a High-Precision Capacitive MEMS Accelerometer

Liu

et al. 2020

Sensors

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Capacitive MEMS accelerometers with area-variable periodic-electrode displacement transducers found wide applications in disaster monitoring, resource exploration and inertial navigation. The bonding-induced warpage, due to the difference in the coefficients of thermal expansion of the bonded slices, has a negative influence on the precise control of the interelectrode spacing that is essential to the sensitivity of accelerometers. In this work, we propose the theory, simulation and experiment of a method that can alleviate both the stress and the warpage by applying different bonding temperature on the bonded slices. A quasi-zero warpage is achieved experimentally, proving the feasibility of the method. As a benefit of the flat surface, the spacing of the capacitive displacement transducer can be precisely controlled, improving the self-noise of the accelerometer to 6 ng/√Hz @0.07 Hz, which is about two times lower than that of the accelerometer using a uniform-temperature bonding process.

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