2004
DOI: 10.1007/bf02705410
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Thermodynamic analysis of liquid source chemical vapor deposition process for the preparation of a Ba-Sr-Ti oxide film

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Cited by 4 publications
(2 citation statements)
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“…For example, BST is a candidate dielectric material for the fabrication of capacitors in modern dynamic random access memory (DRAM). [1][2][3][4] In spite of difficulties encountered in process control, metalorganic chemical vapor deposition (MOCVD) is considered to be one of promising methods for use in producing films because of its excellent step coverage and high deposition rates. Although considerable progress has been made in the preparation of BST thin films using MOCVD, the selection of metalorganic compounds continues to be the key problem in the design of the process.…”
Section: Introductionmentioning
confidence: 99%
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“…For example, BST is a candidate dielectric material for the fabrication of capacitors in modern dynamic random access memory (DRAM). [1][2][3][4] In spite of difficulties encountered in process control, metalorganic chemical vapor deposition (MOCVD) is considered to be one of promising methods for use in producing films because of its excellent step coverage and high deposition rates. Although considerable progress has been made in the preparation of BST thin films using MOCVD, the selection of metalorganic compounds continues to be the key problem in the design of the process.…”
Section: Introductionmentioning
confidence: 99%
“…[5][6][7] The titanium source compound is generally thought to strongly influence the step coverage of a deposited film. 1) Ti precursors that are commonly used in film deposition are mainly alkoxides and -diketonates, such as Ti(O-iPr) 4 and Ti(O-iPr) 2 (dpm) 2 . Ti(O-iPr) 2 (dpm) 2 is widely used in the preparation of BST films because of its affinity for the typically-used Ba and Sr sources, Ba(dpm) 2 and Sr(dpm) 2 .…”
Section: Introductionmentioning
confidence: 99%