Thermodynamic description of the Au–Ge–Sb ternary system

Wang, J.; Leinenbach, Christian; Roth, M.

doi:10.1016/j.jallcom.2009.06.030

Cited by 30 publications

(29 citation statements)

References 24 publications

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“…5 The addition of metals, such as Si, Sn, Sb or In, to the eutectic alloy leads to a further decrease in the melting point. [6][7][8] Therefore, despite their high cost, Au-Ge-based alloys have been proposed as possible high-temperature leadfree solder materials for highly loaded components such as high-power microelectromechanical systems (MEMS) devices but also in space technology as well as for corrosion-resistant solders for components exposed to aggressive media such as for sensors in corrosive atmospheres and biomedical devices. [9][10][11] The soldering process consists in the formation of a joint between the molten solder and a solid metal substrate.…”

Section: Introductionmentioning

confidence: 99%

Wetting and Soldering Behavior of Eutectic Au-Ge Alloy on Cu and Ni Substrates

Leinenbach

Valenza

Giuranno

et al. 2011

Journal of Elec Materi

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Au-Ge-based alloys are interesting as novel high-temperature lead-free solders because of their low melting point, good thermal and electrical conductivity, and high corrosion resistance. In the present work, the wetting and soldering behavior of the eutectic Au-28Ge (at.%) alloy on Cu and Ni substrates have been investigated. Good wetting on both substrates with final contact angles of 13°to 14°was observed. In addition, solder joints with bond shear strength of 30 MPa to 35 MPa could be produced under controlled conditions. Cu substrates exhibit pronounced dissolution into the Au-Ge filler metal. On Ni substrates, the NiGe intermetallic compound was formed at the filler/substrate interface, which prevents dissolution of Ni into the solder. Using thin filler metal foils (25 lm), complete consumption of Ge in the reaction at the Ni interface was observed, leading to the formation of an almost pure Au layer in the soldering zone.

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Section: Introductionmentioning

confidence: 99%

Wetting and Soldering Behavior of Eutectic Au-Ge Alloy on Cu and Ni Substrates

Leinenbach

Valenza

Giuranno

et al. 2011

Journal of Elec Materi

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“…Recently, thermodynamic descriptions of many binary and ternary systems including Au-Pb, Au-Al, Au-In, Au-Zn binary systems and Au-Ag-Si, Au-Ag-Sn, Au-Bi-Sb, Au-Ge-Sn, Au-Ge-Sb, Au-Ge-Si, Au-Ag-Pb, Au-In-Sn, Au-In-Sb, Au-Si-Sn and Au-Co-Sn ternary systems have been developed by Wang, Liu and Jin [12][13][14][15][16][17][18][19][20][21][22][23][24][25][26] using the CALPHAD method [27,28]. Thermodynamic database of the corresponding binary and ternary systems has been established on the basis of their assessments.…”

Section: Introductionmentioning

confidence: 99%

Thermodynamic modeling of the Au–Sb–Si ternary system

Wang

Liu

et al. 2011

Journal of Alloys and Compounds

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a b s t r a c tThermodynamic optimization of the Au-Sb binary system was updated as well as the Si-Sb binary system was assessed thermodynamically using the CALPHAD method based on the critical review of the available experimental information from the published literature. The solution phases including liquid, fcc A1(Au), diamond A4(Si) and rhombohedral A7(Sb), are modeled as substitutional solutions and their excess Gibbs energies are expressed by a Redlich-Kister polynomial. The solubility of Si in the intermetallic compound AuSb 2 is not taken into account because of the lack of experimental information. Combined with previous assessment of the Au-Si binary system, thermodynamic modeling of the Au-Sb-Si ternary system was performed to reproduce well the measured phase equilibria. The liquidus projection and several vertical sections of this ternary system were calculated, which are in reasonable agreement with the reported experimental data.

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“…Reliable thermodynamic information on the relative stabilities of TM-germanides is essential to control the interfacial microstructure evolution and thus to design optimal processing. On the other hand, Au-based alloys containing Ge are of interest for novel high temperature lead-free solder alloys [6][7][8][9]. For example, the Au-Ge binary system is characterised by a deep eutectic reaction with its temperature of around 360 • C, making it interesting for high temperature Au-based solders.…”

Section: Introductionmentioning

confidence: 99%