Enhanced interstitial diffusion in tin is a phenomenon
often observed
during ion-beam irradiation and in lead-free solders. For the latter,
this not very well understood, strain-driven mechanism results in
the growth of whiskers, which can lead to unwanted shorts in electronic
designs. In ion-beam physics, this phenomenon is often observed as
a result of the enhanced formation of Frenkel pairs in the energetic
collision cascade. Here, we show how epitaxial growth of tin extrusions
on tin-oxide-covered tin spheres can be induced and simultaneously
observed by implanting helium using a helium ion microscope. Calculations
of collision cascades based on the binary collision approximation
and 3D-lattice-kinetic Monte Carlo simulations show that the implanted
helium will occupy vacancy sites, leading to a tin interstitial excess.
Sputtering and phase separation of the tin oxide skin, which is impermeable
for tin atoms, create holes and will allow the epitaxial overgrowth
to start. Simultaneously, helium accumulates inside the irradiated
spheres. Fitting the simulations to the experimentally observed morphology
allows us to estimate the tin to tin-oxide interface energy to be
1.98 J m–2. Our approach allows the targeted initiation
and in situ observation of interstitial diffusion-driven effects to
improve the understanding of the tin-whisker growth mechanism observed
in lead-free solders.