Thermodynamic modeling of the Re–Si–B system

Yang, Ying; Chen, Shuanglin; Chang, Y. A.

doi:10.1016/j.intermet.2009.06.003

Cited by 7 publications

(1 citation statement)

References 19 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…AuSn, AuSn 2 and AuSn 4 are the main IMCs between Au and Sn from Au-Sn binary phase diagram [19]. Both the brittle AuSn 4 phase and the weak interface between the Au-Sn IMCs and the solder matrix will lead to significant strength reduction and embrittlement of the gold soldered joint [20][21][22][23][24][25][26]. The thickness of Au layer, the soldering temperature and time, temperature and time of solid-state thermal cycling and aging have the important effect on the embrittlement [27][28][29][30][31][32][33].…”

Section: Introductionmentioning

confidence: 99%

Influence of Thermal Aging on Microstructure and Property of Gold Alloy Joint Soldered by Sn-based Solder

et al. 2019

MATEC Web Conf.

View full text Add to dashboard Cite

As an undisputed material of choice to guarantee reliability in a broad range of high performance and safety-critical applications in the electrical contacts and connectors, AuAgCu alloy was soldered with Ag-plated Cu wire using Sn-based solder. To clarify the embrittlement and strength reduction of the gold soldered joint, the microstructure and its influence on the macroand micro-mechanical properties of the soldered joint under various thermal aging conditions were studied. The result indicated that, taking the mechanical property consideration alone, Sn-based solder could be used to join AuAgCu alloy. Different from the embrittlement and strength reduction of the soldered joint of pure gold, although the brittle fracture features appeared in mechanical test of the soldered joints, the shear strength of soldered joint after thermal aging at 125 °C almost did not decrease in comparison with that before thermal aging. Nevertheless, too high temperature and long time still had bad influence on mechanical properties. Otherwise, thermal aging had a large effect on the IMCs layer, as aging temperature elevated and aging time increased, IMCs layer became thicker, more complex components and multiply-sublayers structure with different microhardness. The study provides a fundamental understanding for gold alloy soldering.

show abstract