Thermodynamic prediction of interface phases at Cu/solder joints

Lee, Hyuck Mo; Yoon, Seung Wook; Lee, Byeong-Joo

doi:10.1007/s11664-998-0065-8

Cited by 90 publications

(51 citation statements)

References 16 publications

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“…Once the Sn supply was not sufficient for Cu 6 Sn 5 growth, the continuous supply of the Cu atoms from the underlying Cu layer would gradually transform the Cu 6 Sn 5 phase into Cu 3 Sn. Figure 4 shows the calculated isothermal section of the ternary Sn-Ag-Cu system at 190°C, 17 which is close to the reaction temperature (200°C) used in the present study. It can be found that the Ag 3 Sn phase is not in equilibrium with the Cu substrate.…”

Section: Morphological Evolution Of the Intermetallic Compoundssupporting

confidence: 62%

Intermetallic Compound Formation and Evolution in Solid-State Sn/Immersion-Ag/Cu Trilayer Interfacial Reactions on a Flexible Polymer Board

Lin

Chen

2009

Journal of Elec Materi

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Immersion Ag is a promising candidate Pb-free surface finish on printed circuit boards (PCBs). For flexible PCB and optoelectronic packaging, solid-state bonding rather than reflow is commonly used to join the chips to the PCB with Sn-based solders, after which the immersion Ag layer remains at the joint interface and participates in the interfacial reactions at the solder joints. Solder joint samples composed of a Sn/Ag/Cu trilayer on flexible PCBs were prepared to study the interfacial reactions at 150A degrees C and 200A degrees C. Three phases, Ag(3)Sn, Cu(6)Sn(5), and Cu(3)Sn, were sequentially formed at the interface. Remarkable change of the morphology of the Ag(3)Sn phase was observed during thermal aging. The thickness of the immersion Ag layer was found to have significant effects on the growth rates of the Cu(6)Sn(5) and Cu(3)Sn phases and the void formation in the Cu(3)Sn phase

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Section: Morphological Evolution Of the Intermetallic Compoundssupporting

confidence: 62%

Intermetallic Compound Formation and Evolution in Solid-State Sn/Immersion-Ag/Cu Trilayer Interfacial Reactions on a Flexible Polymer Board

Lin

Chen

2009

Journal of Elec Materi

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“…In general, c-Cu 5 Zn 8 phase is brittle and has a negative effect on the quality of joints to copper. 33 Figure 12 presents a comparison of the growth kinetics of the c-and e-phases on the copper and copper-graphene substrates. The growth rate is described by the equation D = k 9 t 0.5 , where D is the thickness of the layer, k is the growth rate of the phase, and t is time.…”

Section: Effect Of Graphene Layers On Phenomena Occurring At Interfacmentioning

confidence: 99%

Effect of Graphene Layers on Phenomena Occurring at Interface of Sn-Zn-Cu Solder and Cu Substrate

Pstruś

Ozga

Gancarz

et al. 2017

Journal of Elec Materi

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Cu and graphene-coated Cu substrates spread with Sn-Zn eutectic-based alloy containing 0.5 wt.%, 1 wt.%, or 1.5 wt.% Cu have been studied at 250°C. Soldering experiments were performed for wetting time of 3 min, 8 min, 15 min, 30 min, and 60 min in (1) presence of flux without argon protective atmosphere and (2) fluxless in argon atmosphere. Solidified solder-pad couples were cross-sectioned and examined using scanning electron microscopy with energy-dispersive spectroscopy to study their interfacial microstructure. To assess the effect of graphene coating on solder, Cu pads were covered by graphene using chemical vapor deposition. The results revealed that the liquid solder did not wet the graphene-coated copper in the absence of flux. Wetting took place only with use of flux, because it destroyed the graphene layer and enabled contact of the liquid solder with the copper. Experiments were designed to demonstrate the effect of Cu addition and graphene coating on the kinetics of the formation and growth of Cu 5 Zn 8 and CuZn 4 phases identified by x-ray diffraction analysis, Raman spectroscopy, and energy-dispersive spectroscopy. A decrease of about 60% in the thickness of the intermetallic layer was observed when applying the graphene interlayer in presence of flux. Addition of copper to the Sn-Zn alloy improved the wettability as the copper content was increased.

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“…and substrates It has been reported 2,12,20) that Cu 5 Zn 8 formed at the interface between the Sn-Zn solder and the Cu substrate. Cu 5 Zn 8 , formed between Sn-9Zn and Cu with a thickness of about 3 mm, was also detected in this study (Fig.…”

Section: Interfacial Reactions Between Sn-zn Based Soldersmentioning

confidence: 99%

Wetting Properties of and Interfacial Reactions in Lead-free Sn-Zn Based Solders on Cu and Cu Plated with an Electroless Ni-P/Au Layer

Huang

Lin

2004

Mater. Trans.

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The wetting time, wetting force, contact angle and interfacial reaction of and Sn-9Zn (mass%) lead-free solders on Cu and Cu/Ni-P/Au substrates have been investigated. The Ag content, X, of the solders investigated was 0-3 mass%. The results indicate that the wettability of Sn-8.55Zn-0.45Al-XAg solders decreases with increasing Ag content. The Sn-8.55Zn-0.45Al-XAg solders containing low Ag content, less than 1mass%, exhibit better wettability than the eutectic Sn-9Zn solder. Furthermore, it was also found that the wettability of Sn-Zn based solders on Cu substrate is better than that on Cu/Ni-P/Au substrate. The when used on Cu and Cu/Ni-P/Au, Sn-9Zn solder forms Cu 5 Zn 8 and AuZn 3 respectively, while the Al-containing solders form Al 4:2 Cu 3:2 Zn 0:7 and Al 2 (Au, Zn). Further addition of Ag gave rise to AgZn 3 particles attached to the underlying intermetallic compound.

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Thermodynamic prediction of interface phases at Cu/solder joints

Cited by 90 publications

References 16 publications

Intermetallic Compound Formation and Evolution in Solid-State Sn/Immersion-Ag/Cu Trilayer Interfacial Reactions on a Flexible Polymer Board

Intermetallic Compound Formation and Evolution in Solid-State Sn/Immersion-Ag/Cu Trilayer Interfacial Reactions on a Flexible Polymer Board

Effect of Graphene Layers on Phenomena Occurring at Interface of Sn-Zn-Cu Solder and Cu Substrate

Wetting Properties of and Interfacial Reactions in Lead-free Sn-Zn Based Solders on Cu and Cu Plated with an Electroless Ni-P/Au Layer

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