Thermodynamic properties of Al in ternary lead-free solder Al-Sn-Zn alloys

Abstract

Thermodynamic properties of Al were calculated using the molecular interaction volume model (MIVM) by analyzing the activities of components in the constitutive binary Al-Sn, Al-Zn and Sn-Zn subsystems of the ternary lead-free solder Al-Sn-Zn systems. The activities of Al content in the ternary system at three cross-sections with constant molar ratios of Sn:Zn = 2:1, 1:1 and 1:2, respectively, were calculated and compared with available experimental data at 973 K. Based on the agreement between the calculated activity values and corresponding literature data for Al-Sn-Zn alloys and their subsystems, the activity of Al content in the ternary Al-Sn-Zn system was estimated at the same cross-sections and mole ratios in the temperature range of 1073 K to 1373 K, respectively. It has been observed through the computed activity values of Al that the thermodynamic properties of the ternary Al-Sn-Zn systems do not change appreciably with temperature across the molar sections.

Theoretical exploration of thermodynamic characteristics in lead-free liquid alloys: Zn-Bi-In System

“…These starting values are then adjusted when component activities in liquid binary alloys are calculated using equations ( 2) and (3). Odusote et al (2017) [28] explained that once the appropriate values of A ji and A ij at a particular temperature is established, their corresponding values at different temperatures can also be derived.…”

Computational assessment of Sn activities and integral excess free energy change for mixing in the Sn-Au-Cu ternary liquid alloys using the molecular interaction volume model

“…Meanwhile, r oi corresponds to the first peak value of the radial distribution function, and r mi stands for the initial value of the radial distribution function. The pair's potential energy's interaction parameters (A ji and A ij ) are given by [15].…”

“…This is crucial for comprehending metallurgical processes and observing how chemical interactions occur between alloy systems and standard base materials [7][8][9][10][11][12]. Au-Sn, Sn-Ag, Sn-Cu, Al-Sn-Zn, Sn-Ag-Cu, Sn-Sb-Bi, Zn-In-Sn, Sn-Ag-Cu, In-Bi-Sn, Sn-Ag-Cu-Zn, Sn-Ag-Cu-Sb, and other combinations have all proven to be effective alternatives to traditional Sn-Pb solder alloys [2,6,[13][14][15][16]. In the prediction of thermodynamic properties within ternary and more complex systems, a wide range of geometric models, including but not limited to Kohler, Muggianu, Collinet, Chou, the Kaptay model, R-K equations, and others [17,18], find wide application.…”