Thermodynamics cycle analysis and numerical modeling of thermoelastic cooling systems

Qian, Suxin; Ling, Jiazhen; Hwang, Yunho; Radermacher, Reinhard; Takeuchi, Ichiro

doi:10.1016/j.ijrefrig.2015.04.001

Cited by 127 publications

(57 citation statements)

References 44 publications

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“…When using the latent heat from DSC results, T ad can be estimated to be 11.6 K, corresponding to γ ranging from 0.39 to 1.16. The value for the state-of-the-art nickel-titanium binary alloy under compression is around 2, and CuZnAl under tensile mode with other compositions can be as high as 1.5 [29].…”

Section: Materials Evaluationmentioning

confidence: 94%

Elastocaloric effect in CuAlZn and CuAlMn shape memory alloys under compression

Qian

Geng

Wang

et al. 2016

Phil. Trans. R. Soc. A.

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This paper reports the elastocaloric effect of two Cu-based shape memory alloys: Cu 68 Al 16 Zn 16 (CuAlZn) and Cu 73 Al 15 Mn 12 (CuAlMn), under compression at ambient temperature. The compression tests were conducted at two different rates to approach isothermal and adiabatic conditions. Upon unloading at a strain rate of 0.1 s −1 (adiabatic condition) from 4% strain, the highest adiabatic temperature changes (Δ T ad ) of 4.0 K for CuAlZn and 3.9 K for CuAlMn were obtained. The maximum stress and hysteresis at each strain were compared. The stress at the maximum recoverable strain of 4.0% for CuAlMn was 120 MPa, which is 70% smaller than that of CuAlZn. A smaller hysteresis for the CuAlMn alloy was also obtained, about 70% less compared with the CuAlZn alloy. The latent heat, determined by differential scanning calorimetry, was 4.3 J g −1 for the CuAlZn alloy and 5.0 J g −1 for the CuAlMn alloy. Potential coefficients of performance (COP mat ) for these two alloys were calculated based on their physical properties of measured latent heat and hysteresis, and a COP mat of approximately 13.3 for CuAlMn was obtained. This article is part of the themed issue ‘Taking the temperature of phase transitions in cool materials’.

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Section: Materials Evaluationmentioning

confidence: 94%

Elastocaloric effect in CuAlZn and CuAlMn shape memory alloys under compression

Qian

Geng

Wang

et al. 2016

Phil. Trans. R. Soc. A.

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“…Furthermore, the model was used to guide the design of a real 100 W thermoelastic cooling prototype. Figure 1 introduces the basic cycle concept developed in the previous study (Qian et al, 2015b) for a reversed Brayton thermoelastic cooling system. As shown in Figure 1 (a), the previously designed system consisted of two SMA beds, a driving mechanism between the SMA beds, a heat source, and a heat sink.…”

Section: A C C E P T E D Accepted Manuscriptmentioning

confidence: 99%

“…The motivation of this study is due to the major issue that the system COP was predicted to be only 1.7 with temperature lift under 10 K (Qian et al, 2015b). It worsened when the parameters of the transient model were modified to consider all the metal thermal mass using the developed thermoelastic cooling prototype geometries.…”

Section: A C C E P T E D Accepted Manuscriptmentioning

confidence: 99%

“…To make the previously developed physics based model (Qian et al, 2015b) and the modified physics based model in this study more convincing, the modeling results were validated with the measured data using our first compressive thermoelastic cooling prototype developed. More details of the test facility set up and the prototype functioning details are introduced by Qian et al…”

Section: Model Validationmentioning

confidence: 99%

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Performance enhancement of a compressive thermoelastic cooling system using multi-objective optimization and novel designs

Qian

Alabdulkarem

Ling

et al. 2015

International Journal of Refrigeration

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Thermoelastic cooling is a recently proposed, novel solid-state cooling technology. It has the benefit of not using high global warming potential (GWP) refrigerants which are used in vapor compression cycles (VCCs). Performance enhancements on a thermoelastic cooling prototype were investigated. A few novel design options aiming to reduce the cyclic loss were proposed. It was found that the maximum temperature lift increased from 6.6 K to 27.8 K when applying the proposed novel designs, corresponding to 0 to 152 W cooling capacity enhancement evaluated under 10 K water-water system temperature lift. In addition, a multi-objective optimization problem was formulated and solved using the genetic algorithm to maximize the system capacityACCEPTED MANUSCRIPT 2 and coefficient of performance (COP). With all the novel designs, the optimization could further enhance 31% COP, or 21% cooling capacity, corresponding to COP of 4.1 or 184 W maximum cooling capacity. Nomenclature Symbols A area [m 2 ] COP coefficient of performance [-] c p specific heat [J·g -1 ·K -1 ] D diameter [m] GWP global warming potential HR heat recovery HTF heat transfer fluid h heat transfer coefficient [W·m -2 ·K -1 ] ID internal diameter [m] k thermal conductivity [W·m -1 ·K -1 ] L length [m] N quantity [-] OD outside diameter [m] PEEK polyether-ether-ketone ra nitinol heat transfer area to volume ratio [m -1 ] SMAs shape memory alloys sec second T temperature [K] M A N U S C R I P T A C C E P T E D ACCEPTED MANUSCRIPT 3 t time, or duration [sec] t* heat recovery duration coefficient [-] u fluid mean velocity [m·s -1 ] VCC vapor compression cycle α thermal diffusivity [m 2 ·s -1 ] β tubes holder contact area ratio [-] δ equivalent thickness [m] κ thermal mass factor ρ density [kg·m -3 ]

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“…[9][10][11] The development of elastocaloric cooling devices is just at the beginning. [12][13][14][15][16] Recently, first macroscale elastocaloric cooling demonstrators have been reported, reaching temperature differences between heat source and sink of 1.5 and 7 K for compressive and tensile loading of TiNibased SMA, respectively. 17,18 Due to favorable scaling behavior, elastocaloric cooling becomes highly attractive also for microcooling, which gains importance, e.g., in microelectronics and lab-on-chip systems.…”

mentioning

confidence: 99%

TiNi-based films for elastocaloric microcooling— Fatigue life and device performance

et al. 2016

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The global trend of miniaturization and concomitant increase of functionality in microelectronics, microoptics, and various other fields in microtechnology leads to an emerging demand for temperature control at small scales. In this realm, elastocaloric cooling is an interesting alternative to thermoelectrics due to the large latent heat and good down-scaling behavior. Here, we investigate the elastocaloric effect due to a stress-induced phase transformation in binary TiNi and quaternary TiNiCuCo films of 20 μm thickness produced by DC magnetron sputtering. The mesoscale mechanical and thermal performance, as well as the fatigue behavior are studied by uniaxial tensile tests combined with infrared thermography and digital image correlation measurements. Binary films exhibit strong features of fatigue, involving a transition from Lüders-like to homogeneous transformation behavior within three superelastic cycles. Quaternary films, in contrast, show stable Lüders-like transformation without any signs of degradation. The elastocaloric temperature change under adiabatic conditions is −15 K and −12 K for TiNi and TiNiCuCo films, respectively. First-of-its-kind heat pump demonstrators are developed that make use of out-of-plane deflection of film bridges. Owing to their large surface-to-volume ratio, the demonstrators reveal rapid heat transfer. The TiNiCuCo-based devices, for instance, generate a temperature difference of 3.5 K within 13 s. The coefficients of performance of the demonstrators are about 3.

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Thermodynamics cycle analysis and numerical modeling of thermoelastic cooling systems

Cited by 127 publications

References 44 publications

Elastocaloric effect in CuAlZn and CuAlMn shape memory alloys under compression

Elastocaloric effect in CuAlZn and CuAlMn shape memory alloys under compression

Performance enhancement of a compressive thermoelastic cooling system using multi-objective optimization and novel designs

TiNi-based films for elastocaloric microcooling— Fatigue life and device performance

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