Thermoelectric Characterization Platform for Electrochemically Deposited Materials

Barati, Vida; Fernández, Javier García; Geishendorf, Kevin; Schnatmann, Lauritz; Lammel, Michaela; Kunzmann, Alexander; Pérez, Nicolás; Li, Guodong; Schierning, Gabi; Nielsch, Kornelius; Reith, Heiko

doi:10.1002/aelm.201901288

Cited by 3 publications

(3 citation statements)

References 28 publications

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“…This preparation technique of PowderMEMS is applicable to the preparation of TE materials with following requirements: 1) both the TE matrix and the binder have the same sign of the Seebeck coefficient; and 2) the binder has a lower melting temperature than the TE matrix. According to these preparation rules, varying TE materials including metallic and semi-metallic compounds (e.g., Te-free MgSbBi, [66] CoNi, [67] SnSe, [47] and Half-Heusler [68] ) can be utilized for the fabrication of TE films and pillars. [66,67] The availability of material freedom opens up an unexceptionally wide range of possible TE applications.…”

Section: Microelectromechanical-systems Compatibility and Microstruct...mentioning

confidence: 99%

“…According to these preparation rules, varying TE materials including metallic and semi-metallic compounds (e.g., Te-free MgSbBi, [66] CoNi, [67] SnSe, [47] and Half-Heusler [68] ) can be utilized for the fabrication of TE films and pillars. [66,67] The availability of material freedom opens up an unexceptionally wide range of possible TE applications.…”

Section: Microelectromechanical-systems Compatibility and Microstruct...mentioning

confidence: 99%

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A Novel PowderMEMS Technique for Fabrication of Low‐Cost High‐Power‐Factor Thermoelectric Films and Micro‐Patterns

Deng

Zhang

et al. 2023

Adv Eng Mater

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Thermoelectric (TE) films, which are normally fabricated by MicroElectroMechanical‐Systems (MEMS) technology, are crucial for the development of micro‐TE devices (e.g., Peltier coolers for hot‐spot cooling, TE generators). However, achieving a significant TE property (e.g., high power factor) of TE films and a low‐cost fabrication process is challenging. A novel fabrication technique named PowderMEMS to fabricate high‐performance, low‐cost TE films, and micro‐patterns is presented in this article. The TE film is based on agglomeration of micro‐sized N‐type Bi2Te2.5Se0.5(BTS) powders with stoichiometric composition by the molten binder bismuth (Bi). The influence of the key process parameters (e.g., the weight ratio between the TE powder and the binder, the hot‐pressing duration, and pressure) on the TE performance is investigated. The TE film exhibits a maximum power factor of 1.7 mW m−1normalK−2 at room temperature, which is the highest value reported so far for the state‐of‐the‐art TE thick film (thickness > 10 μm). Besides, the PowderMEMS‐based TE films are successfully patterned to the micro‐pillar array, which opens up a new MEMS‐compatible approach for manufacturing micro‐TE devices.

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Section: Microelectromechanical-systems Compatibility and Microstruct...mentioning

confidence: 99%

Section: Microelectromechanical-systems Compatibility and Microstruct...mentioning

confidence: 99%

A Novel PowderMEMS Technique for Fabrication of Low‐Cost High‐Power‐Factor Thermoelectric Films and Micro‐Patterns

Deng

Zhang

et al. 2023

Adv Eng Mater

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“…The most important performance measure of a thermoelectric material is its thermoelectric figure of merit zT = (S 2 σ κ −1 ) T, where S is the Seebeck coefficient; σ is the electrical conductivity; κ is the total thermal conductivity; and T is the absolute temperature. [27,28] The performance of thermoelectric materials has improved dramatically in recent years: for instance, zT was improved from around 1 [29] in bismuth telluride and bismuth selenide systems to 2.6 in SnSe single crystals. [30] Although the performance of thermoelectric materials has improved greatly, that has not necessarily led to a substantial improvement in the performance of the devices themselves.…”

Section: Introductionmentioning

confidence: 99%

Geometric Study of Polymer Embedded Micro Thermoelectric Cooler with Optimized Contact Resistance

Dutt

Deng

et al. 2022

Adv Elect Materials

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any moving parts and are thus maintenance free, and also environmentfriendly. [1][2][3][4] They are used for the thermal management of parts of electric circuits [5] or optoelectronic devices, [6] cooling of power electronics, [7] powering devices for the internet-of-things, [8] and body-powered wearable electronics. [9][10][11] With increased reliability and accurate temperature control, they could also be effective replacements for macroscopic thermoelectric devices (TEDs) in medical applications, [12][13][14] for example DNA replication [15] or heating and cooling experiments for treating lowgrade tissue injuries. [16] Early μTEDs were fabricated by J.-P. Fleurial and co-workers. [17] During the past two decades, as the approaches to fabrication have evolved continuously, so has the performance of μTEDs. [1,2,[18][19][20] In 2003, Snyder et al. fabricated a cross plane μTED using electrochemical deposition, which showed a maximum cooling of 2 K at 110 mA. [2] μTEDs based on superlattice materials were later fabricated but were not characterized as coolers. [21] In 2007, Huang et al. fabricated a device using MEMS technology in combination with electroplating and reported a maximum cooling of Micro-thermoelectric devices (μTEDs) are used for bio-medical applications, powering internet-of-things devices, and thermal management. For such applications, μTEDs need to have a robust packaging so that the devices can be brought in direct thermal contact with the target heat sink and source. The packaging technology developed for macroscopic modules needs improvement as it cannot be applied to μTEDs due to a large thermal resistance between the capping material and the device which deteriorates its performance. In this work, μTEDs with high net cooling temperature are fabricated by optimizing the contact resistance and device design combined with a novel packaging technique that is fully compatible with on-chip integration. The simulations and experiments demonstrate that the additional thermal loss caused by the packaging leads to an only marginal decrease in the net cooling temperature. The devices achieve a high net cooling temperature of 10.8 K without packaging and 9.6 K with packaging at room temperature. The packaging only slightly increases the thermal response time of the devices, which also shows an extremely high reliability of over 85 million cooling cycles. This simple packaging technique together with robust device performance is a step toward wide-spread application of μTEDs.The ORCID identification number(s) for the author(s) of this article can be found under https://doi.org/10.1002/aelm.202101042.

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Understanding and design of spin-driven thermoelectrics

Polash

Moseley

Zhang

et al. 2021

Cell Reports Physical Science

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Thermoelectric Characterization Platform for Electrochemically Deposited Materials

Cited by 3 publications

References 28 publications

A Novel PowderMEMS Technique for Fabrication of Low‐Cost High‐Power‐Factor Thermoelectric Films and Micro‐Patterns

A Novel PowderMEMS Technique for Fabrication of Low‐Cost High‐Power‐Factor Thermoelectric Films and Micro‐Patterns

Geometric Study of Polymer Embedded Micro Thermoelectric Cooler with Optimized Contact Resistance

Understanding and design of spin-driven thermoelectrics

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