“…The interface impact of scattering can even cause crossovers in the nanostructure conductivity such that a material with high bulk thermal conductivity is not necessarily the best thermal conductor upon nanostructuring. 21 While thermal-conductivity suppressions can work to improve the efficiency of both thermoelectric and thermoionic cooling, 1, 40,41,42,43,44,45,46 room-temperature estimates, 47 ℓ mfp (T = 300K) ≥ 100 nm, also testifies to some adverse effects even for present devices. Worse, the quest to nanosize modern electronics can only exacerbate the thermal dissipation problems 2,36 since the increase in packing density simultaneously will produce a further degradation in the effective thermaltransport properties.…”