Thermoelectric module design strategy for solid-state refrigeration

Pietrzyk, Kyle; Ohara, Brandon; Watson, Thomas C.; Gee, Madison; Avalos, Daniel; Lee, Hohyun

doi:10.1016/j.energy.2016.08.058

Cited by 20 publications

(10 citation statements)

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“…The estimations of the optimal L Ã and the peak cooling power density by Equations ( 21) and ( 22) are validated over a broad range of the heat transfer coefficients from 5 to 5000 W m À2 K À1 , which is able to cover various scenarios, including natural air convection, forced convection, and even liquid-vapor phase change heat transfer. As indicated in Figure 5A,B, the optimal L Ã is in general evaluated within ±15%, while the peak cooling power density calculated by substituting Equation (22) into Equation (21) shows negligible error all over the whole heat transfer and temperature difference range. The fact that a rough estimation of the optimal L Ã still leads to an excellent estimation of the peak cooling power density is illustrated in detail in SI (Dependence of cooling power density on L*).…”

Section: Maximization Of Cooling Power Under Given H H H C and δTmentioning

confidence: 77%

“…The fact that a rough estimation of the optimal L Ã still leads to an excellent estimation of the peak cooling power density is illustrated in detail in SI (Dependence of cooling power density on L*). Equation (22) suggests that the optimal L Ã decreases with h h but increases with the ratio h h =h c , so it could rise to tens of centimeters under very low h h and h c (see Figure 5A). As a reference, we present in Figure 5C the scope of L Ã for the commercially available TEC modules, 55 as well as the relationship between the maximum cooling power density (ΔT ¼ 0) and L Ã over more than 370 types of products.…”

Section: Maximization Of Cooling Power Under Given H H H C and δTmentioning

confidence: 99%

“…First, a heat balance analysis is performed at the thermal interfaces, to derive primary expressions for the cooling power and input electric power. Then a numerical scanning approach is used to seek the maximum cooling power, [17][18][19][20] temperature difference, 21,22 or COP with respect to the electric current. Only a few analytical formulations on the key performance indices are deduced under very limited conditions [23][24][25][26] due to the high complexity.…”

Section: Introductionmentioning

confidence: 99%

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A general White–Box strategy for designing thermoelectric cooling system

Zhu

Deng

Qian

et al. 2022

InfoMat

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Thermoelectric cooling (TEC) is critically important in thermal management of laser modules or chips and potentially for personalized thermoregulation. The formulae for efficiency in standard textbooks can only describe the performance of a TEC module with ideal thermal conditions, that is, fixed terminal temperatures, but are unable to deal with a real TEC system where heat transfer at its interfaces with the heat source and sink are finite and with thermal resistances. Here, we define the TEC system‐level performance indices, that is, the maximum cooling power, temperature difference, and coefficient of performance, by introducing a set of explicit formulae. The external heat transfer conditions are taken into account as dimensionless thermal resistance parameters. With these formulae, the TEC system performances are evaluated elegantly with errors well within ±5% over broad operating conditions. We further optimize the cooling power and the coefficient of performance in practical scenarios and establish a general White–Box design procedure for TEC systems, which enables a transparent design process and straightforward analysis of performance bottlenecks. A set of cooling experiments are performed to validate the analytical model and to illustrate the dependence of system design on realistic thermal conditions. By choosing the suitable TEC module parameter under given external heat transfer conditions, the cooling power can be improved by more than 100%. This work sheds some light on the integral design of TEC systems for broad applications to take full advantage of the advanced thermoelectric materials in the cooling field.image

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Section: Maximization Of Cooling Power Under Given H H H C and δTmentioning

confidence: 77%

Section: Maximization Of Cooling Power Under Given H H H C and δTmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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A general White–Box strategy for designing thermoelectric cooling system

Zhu

Deng

Qian

et al. 2022

InfoMat

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“…Further still, to make TEGs viable as energy recovery engines many of these legs must be connected in an optimal manner to maximise heat to electrical power conversion. [28][29][30][31] It's important to realize there are more considerations in the design of such systems like, the optimal leg length, geometry, number of legs, stability of the thermal paste applied in the synthesis of modules, as well as how many modules form a functional TEG unit etc. The p-type material has holes as the majority charge carrier meanwhile electrons are the majority charge carriers within n-type materials.…”

Section: Chapter 1 Introductionmentioning

confidence: 99%

“…[34][35][36] This is known as the Peltier effect and can be used in cooling applications such as central processing unit (CPU) heat management, refrigerators, dehumidifiers, and cooling heat flux systems. 28,[37][38][39][40][41] However for this technology to replace more established power generators it would require higher efficiencies. The efficiency is denoted by a dimensionless figure of merit (ZT).…”

Section: Chapter 1 Introductionmentioning

confidence: 99%

Improvement to the thermoelectric properties of PEDOT:PSS

Atoyo¹

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Thermoelectric materials can convert waste heat to electricity without moving parts. Extensive research into improving the efficiency of inorganic thermoelectric materials has allowed some materials such as bismuth tellurides to be commercialized. These materials, however, contain materials in low abundance on earth such as tellurium therefore their use and scaled production would be limited. Organic and hybrid thermoelectric materials can meet the gap for niche markets as well as be synthesized on mass, due to utilization of earth abundant elements such as carbon, sulphur, and nitrogen. The thermoelectric generators require several n and p-type materials connected for optimal efficiency. There are many ways to create inorganic thermoelectric n and p-types. However, for the organic thermoelectric materials the efficiency lags because of their lower electrical conductivity and Seebeck coefficient as well as the lack of effective strategies in the development of n-type materials. Poly(3,4-ethylenedioxythiophene) polystyrene sulfonate (PEDOT:PSS) is one of the most successful and researched p-type organic thermoelectric material and thus, the thesis will explore effective strategies for decoupling the apparent trade-offs observed when improving either the electrical conductivity or Seebeck coefficient. The first major contribution to knowledge discussed in this study is the utilization of a reducing agent treatment on PEDOT-ionic liquid composites (reader is advised to refer to chapter 5). Another significant finding was the successful development of a novel route to an n-type single walled carbon nanotube, PEDOT:PSS composite (please refer to chapter 6). The final and most significant contribution to knowledge in this research project was the development of a set of novel single walled carbon nanotube, ionic liquid, PEDOT:PSS composites whereby after a post treatment with a guanidinium iodide in ethylene glycol solution allowed for improvement of the electrical conductivity from 3.4 S cm -1 to 3665 S cm-1 and Seebeck coefficient from 12 μV K-1 to 27 μV K-1 thereby leading to an optimised power factor of 236 μW m-1 K-1 at 140 °C (please refer to chapter 7).

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Thermoelectric System for Personal Cooling and Heating

Pan

Zhao

2023

Indoor Environment and Sustainable Building

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Thermoelectric module design strategy for solid-state refrigeration

Cited by 20 publications

References 10 publications

A general White–Box strategy for designing thermoelectric cooling system

A general White–Box strategy for designing thermoelectric cooling system

Improvement to the thermoelectric properties of PEDOT:PSS

Thermoelectric System for Personal Cooling and Heating

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