Thermoelectric Modules as Efficient Heat Flux Sensors

Gromov, G.G.

doi:10.1002/9783527698110.ch11

Cited by 4 publications

(1 citation statement)

References 20 publications

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“…Namely, microscale TECs (μTECs) have a fast response time which scales with their critical dimension, can handle much higher heat flux, and can be fabricated using complementary metal oxide semiconductor (CMOS) compatible processes . Applications of μTECs include thermal management of optoelectronic devices, thermal tuning of electronic, photonic, and microelectromechanical (MEM) devices, and sensitive detection of light and heat. , The problem of hotspot cooling , in electronic thermal management is becoming ever more relevant as power densities in electronic circuits rise rapidly. Devices such as processors, light-emitting diodes, and high-frequency GaN high-electron-mobility transistors (HEMTs) are producing heat fluxes >500 W cm –2 .…”

Section: Introductionmentioning

confidence: 99%

Electrodeposited Thin-Film Micro-Thermoelectric Coolers with Extreme Heat Flux Handling and Microsecond Time Response

Corbett

Gautam

Lal

et al. 2021

ACS Appl. Mater. Interfaces

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Thin-film thermoelectric coolers are emerging as a viable option for the on-chip temperature management of electronic and photonic integrated circuits. In this work, we demonstrate the record heat flux handling capability of electrodeposited Bi 2 Te 3 films of 720(±60) W cm −2 at room temperature, achieved by careful control of the contact interfaces to reduce contact resistance. The characteristic parameters of a single leg thin-film devices were measured in situ, giving a Seebeck coefficient of S = −121(±6) μV K −1 , thermal conductivity of κ = 0.85(±0.08) W m −1 K −1 , electrical conductivity of σ = 5.2(±0.32) × 10 4 S m −1 , and electrical contact resistivity of ∼10 −11 Ω m 2 . These thermoelectric parameters lead to a material ZT = 0.26(±0.04), which, for our device structure, allowed a net cooling of ΔT max = 4.4(±0.12) K. A response time of τ = 20 μs was measured experimentally. This work shows that with the correct treatment of contact interfaces, electrodeposited thin-film thermoelectrics can compete with more complicated and expensive technologies such as metal organic chemical vapor deposition (MOCVD) multilayers.

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