Mg2(Si,Sn)-based
compounds have shown great promise
for thermoelectric (TE) applications, as they are nontoxic and comprised
abundantly available constituent elements. In this work, the crystal
structures and TE properties of polycrystalline materials with nominal
compositions Mg2Si0.35Sn0.65–x
Bi
x
(x = 0, 0.015, 0.030, and 0.045) and Mg2Si
y
Sn0.97–y
Bi0.03 (y = 0.30, 0.325, and 0.35) have been investigated.
The electrical conductivity, Seebeck coefficient, and thermal conductivity
are strongly affected by the presence of Bi. Undoped samples showed
higher values of Seebeck coefficients (below 600 K), lower electrical
conductivity, and lower thermal conductivity (above 600 K) in comparison
to the Bi-doped samples. Furthermore, the signs of Seebeck coefficients
are all negative, confirming that n-type conduction is dominant in
these materials. Electrical conductivity was enhanced by increasing
the Bi content up to 3% on the Si/Sn site because of the increasing
amount of electron donors, and the absolute value of Seebeck coefficient
decreased. When the Bi content is greater than 3%, lower zT values were obtained at 773 K. Thermal conductivity values might
decrease with increasing Sn alloying for Mg2Si
y
Sn0.97–y
Bi0.03, as mass and strain fluctuation caused by alloying can
effectively scatter phonons. However, a different behavior was observed
in higher Sn content material, possibly because of the absence of
Mg atoms at the interstitial site [Mgi, on (1/2, 1/2, 1/2)]
and vacancies of Mg atoms at the (1/4, 1/4, 1/4) site, as confirmed
by Rietveld refinements. Outstanding figure of merit values in excess
of unity were achieved with all samples, culminating in zT
max = 1.35.