Proceedings of the 13th Latin American and Caribbean Conference for Engineering and Technology Engineering Education Facing The 2015
DOI: 10.18687/laccei2015.1.1.170
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Thermoelectric Simulation Using Comsol Multiphysics and Analysis of Contact Resistances Effects

Abstract: Abstract-The objectives of this work were to develop a simulation of the thermoelectric transport phenomena in a device leg, and to study the effects of the thermal and electrical contact resistances on the temperature difference across the leg. For this simulation Comsol, a finite element software, was used. The results showed that as the thermal resistance between the sample and the electrode increases the temperature difference increases, improving the performance of the device. Changes in electrical contac… Show more

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