Thermoforming of planar polymer optical waveguides for integrated optics in smart packaging materials

Hoffmann, Gerd-Albert; Wienke, Andreas; Reitberger, Thomas; Franke, Jöerg; Kaierle, Stefan; Overmeyer, Ludger

doi:10.1016/j.jmatprotec.2020.116763

Cited by 8 publications

(3 citation statements)

References 13 publications

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“…In particular, the thermoforming process allows for the development of curved-shape electronics with high-precision geometry and fast processing . Thus, the combination of additive manufacturing techniques with the thermoforming process will allow advanced functional electronic solutions with tailor-made designs and improved integration …”

Section: Introductionmentioning

confidence: 99%

“…12 Thus, the combination of additive manufacturing techniques with the thermoforming process will allow advanced functional electronic solutions with tailor-made designs and improved integration. 13 Nevertheless, for this technique to be sustainable on a large scale, processing and the materials used for composite development must rely on materials that present low toxicity for human health and the environment. In particular, it is urgent to avoid the use of toxic solvents and to explore greener alternatives 14 to the ones commonly used nowadays for a large range of polymers.…”

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Environmentally Friendlier Printable Conductive and Piezoresistive Sensing Materials Compatible with Conformable Electronics

Motealleh

Costa

Peřinka

et al. 2023

ACS Appl. Polym. Mater.

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Flexible and conformable conductive composites have been developed using different polymers, including water-based polyvinylpyrrolidone (PVP), chemical-resistant polyvinylidene fluoride (PVDF), and elastomeric styrene−ethylene−butylene−styrene (SEBS) reinforced with nitrogen-doped reduced graphene oxide with suitable viscosity in composites for printable solutions with functional properties. Manufactured by screen-printing using low-toxicity solvents, leading to more environmentally friendly conductive materials, the materials present an enormous step toward functional devices. The materials were enhanced in terms of filler/binder ratio, achieving screenprinted films with a sheet resistance lower than R sq < 100 Ω/sq. The materials are biocompatible and support bending deformations up to 10 mm with piezoresistive performance for the different polymers up to 100 bending cycles. The piezoresistive performance of the SEBS binder is greater than double that the other composites, with a gauge factor near 4. Thermoforming was applied to all materials, with the PVP-based ones showing the lowest electrical resistance after the bending process. These conductive materials open a path for developing sustainable and functional devices for printable and conformable electronics.

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Section: Introductionmentioning

confidence: 99%