2020 IEEE 40th International Conference on Electronics and Nanotechnology (ELNANO) 2020
DOI: 10.1109/elnano50318.2020.9088886
|View full text |Cite
|
Sign up to set email alerts
|

Thermography investigation of soldered joints for LED mounting

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
1
1
1

Citation Types

0
3
0

Year Published

2021
2021
2022
2022

Publication Types

Select...
2
1
1

Relationship

0
4

Authors

Journals

citations
Cited by 4 publications
(3 citation statements)
references
References 2 publications
0
3
0
Order By: Relevance
“…The mentioned works are also limited regarding the class of anomaly they can detect. The work presented in [20] used thermography to detect hardware anomalies. However, in that case, only the soldered joint quality of PCB mounted LEDs was analyzed.…”
Section: Discussionmentioning
confidence: 99%
See 1 more Smart Citation
“…The mentioned works are also limited regarding the class of anomaly they can detect. The work presented in [20] used thermography to detect hardware anomalies. However, in that case, only the soldered joint quality of PCB mounted LEDs was analyzed.…”
Section: Discussionmentioning
confidence: 99%
“…Automated Optical Inspection (AOI) refers to test techniques where PCB images are compared to a reference image, and dissimilarities denote possible defects [18][19]. Thermography is a similar approach to AOI, where infrared images are used to detect defects [20].…”
Section: Theorical Backgroundmentioning
confidence: 99%
“…For PCB's internal anatomy inspection, X-ray images are frequently employed (Chuang et al, 2010). Finally, thermography is a promising test approach where infrared images are used to detect defects (Mamchur et al, 2020).…”
Section: Related Workmentioning
confidence: 99%