Thermomechanical Impact of Polyurethane Potting on Gun Launched Electronics

Haynes, Aisha; Cordes, J. A.; Krug, J.

doi:10.1155/2013/148362

Cited by 13 publications

(5 citation statements)

References 5 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…These models are based on the material data presented in Refs. [16,17]. For this potting, the glass transition temperature is about -10°C, which is within the usual operating range for the Army.…”

Section: Modeling the Pottingsupporting

confidence: 52%

See 1 more Smart Citation

Assessment of Need for Solder in Modeling Potted Electronics During Gun-Shot

Reinhardt¹,

Cordes²,

Haynes³

et al. 2013

Journal of Applied Mechanics

Self Cite

View full text Add to dashboard Cite

Smart projectiles use electronic components such as circuit boards with integrated circuits to control guidance and fusing operations. During gun-launch, the electronics are subjected to 3-dimensional g-forces as high as 15,000 G, The U.S. Army uses finite element analysis to simulate electronics with high-g, dynamic loads. Electronics are difficult to model due to the large variation in size, from large circuit boards, to very small solder joints and solder pads. This means that to accurately model such small features would require very large models that are computationally expensive to analyze; often beyond the capability of resources available. Therefore, small features such as solder joints are often not included in the finite element models to make the models computationally tractable. The question is: what is the effect on model accuracy without these small features in the model? The purpose of this paper is to evaluate the effect that solder joints and solder pads have on the accuracy of the structural analysis of electronic components mounted on circuit boards during gun shot. Finite element models of simplified circuit boards, chips, and potting were created to do the evaluation. Modal analysis and dynamic structural analysis using typical gun loads were done. Both potting at high temperature (soft) and potting at low temperature (stiff) were used in the dynamic analysis. In the modal analysis there was no potting. All of these models were run with and without solder. In all cases, the results differed between the models with solder and those without. In the models with potting, there was a difference in magnitude and stress distribution between the models with and without solder. This indicates that there is a significant reduction in accuracy when solder is not included in the model.

show abstract

Section: Modeling the Pottingsupporting

confidence: 52%

“…The assembly is at cold temperature (233 K) and the potting is relatively stiff due to operation below the glass transition temperature [16,17]. The Von Mises stresses in the chips near the 15,000 G force are shown in Fig.…”

Section: Case 2: Dynamic Analysis With Bonded Cold Pottingmentioning

confidence: 99%

Assessment of Need for Solder in Modeling Potted Electronics During Gun-Shot

Reinhardt¹,

Cordes²,

Haynes³

et al. 2013

Journal of Applied Mechanics

Self Cite

View full text Add to dashboard Cite

show abstract

“…In 2013, AS Haynes [162] reported a study on the reliability of the potted fuse under coupling effect of temperature and shock. The research found significant changes in the mechanical character of potting material at high temperatures (71 • C) and low temperatures (<51 • C), which affect the reliability of the system.…”

Section: Thermal-shock Couplingmentioning

confidence: 99%

Reliability of MEMS in Shock Environments: 2000–2020

Peng

You

2021

Micromachines

View full text Add to dashboard Cite

The reliability of MEMS in shock environments is a complex area which involves structural dynamics, fracture mechanics, and system reliability theory etc. With growth in the use of MEMS in automotive, IoT, aerospace and other harsh environments, there is a need for an in-depth understanding of the reliability of MEMS in shock environments. Despite the contributions of many articles that have overviewed the reliability of MEMS panoramically, a review paper that specifically focuses on the reliability research of MEMS in shock environments is, to date, absent. This paper reviews studies which examine the reliability of MEMS in shock environments from 2000 to 2020 in six sub-areas, which are: (i) response model of microstructure, (ii) shock experimental progresses, (iii) shock resistant microstructures, (iv) reliability quantification models of microstructure, (v) electronics-system-level reliability, and (vi) the coupling phenomenon of shock with other factors. This paper fills the gap around overviews of MEMS reliability in shock environments. Through the framework of these six sub-areas, we propose some directions potentially worthy of attention for future research.

show abstract

“…Potting is the process of insulating the array with polymeric materials having a high bonding ability, small expansion coefficient, high mechanical endurance, and strong corrosion resistance. The array and potting materials are made into a solid whole, which is waterproof and resistant to shock and vibration [ 3 ]. Because an acoustic transducer array is the object to be potted in this study, the potting should not only ensure protection but also consider the acoustic performance.…”

Section: Introductionmentioning

confidence: 99%

Selection of a Potting Material and Method for Broadband Underwater Cymbal Arrays

Wang

Shim

Roh

2022

Sensors

View full text Add to dashboard Cite

Cymbal transducers are often used in arrays for underwater communication and detection systems. The working environment of a cymbal array is underwater; therefore, waterproofing, salt-corrosion prevention, and impact resistance are necessary for stable operation of the array. Hence, we simulated potting a cymbal array with 15 different rubber and epoxy materials available in the market, using the finite element method, and analyzed their effect on the transmitting voltage response spectrum of the array. From the analysis results, we selected the material that would achieve the widest frequency bandwidth, while preserving the structural stability of the array. A potting method corresponding to the selected material was suggested as well. This study provides guidelines for the selection of a potting material for use in underwater transducer arrays.

show abstract

Thermomechanical Impact of Polyurethane Potting on Gun Launched Electronics

Cited by 13 publications

References 5 publications

Assessment of Need for Solder in Modeling Potted Electronics During Gun-Shot

Assessment of Need for Solder in Modeling Potted Electronics During Gun-Shot

Reliability of MEMS in Shock Environments: 2000–2020

Selection of a Potting Material and Method for Broadband Underwater Cymbal Arrays

Contact Info

Product

Resources

About