2017
DOI: 10.1016/j.egypro.2017.09.282
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Thermomechanical stress analysis of PV module production processes by Raman spectroscopy and FEM simulation

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Cited by 14 publications
(12 citation statements)
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“…One method used to determine thermomechanical stresses from the manufacturing process is Raman spectroscopy, while also controlling the solar cells for cracks using EL imaging. In one study [66], the stress of PV cells was measured using this method, before (after metallization and other cell processes) and after soldering and after the lamination process. The results of the two later stages were compared to a Finite Element Model (FEM) simulating the same stresses, for which they agreed very well.…”
Section: Literature On the Performance Modelling Of Pv Systemsmentioning
confidence: 99%
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“…One method used to determine thermomechanical stresses from the manufacturing process is Raman spectroscopy, while also controlling the solar cells for cracks using EL imaging. In one study [66], the stress of PV cells was measured using this method, before (after metallization and other cell processes) and after soldering and after the lamination process. The results of the two later stages were compared to a Finite Element Model (FEM) simulating the same stresses, for which they agreed very well.…”
Section: Literature On the Performance Modelling Of Pv Systemsmentioning
confidence: 99%
“…The results of the two later stages were compared to a Finite Element Model (FEM) simulating the same stresses, for which they agreed very well. However, the FEM results after the lamination were slightly overestimated due to the linear elastic material model used for EVA [66].…”
Section: Literature On the Performance Modelling Of Pv Systemsmentioning
confidence: 99%
See 1 more Smart Citation
“…The thermo-mechanical behavior of busbar PV module during manufacturing and subsequent life stages has been investigated in these studies: manufacturing process is analyzed by studies [9][10][11][12][13][14][15][16]; cracking effect on output or behavior is analyzed by studies [17][18][19][20][21][22]; behavior during application of different kind of loads is analyzed by studies [1,13,[21][22][23][24][25][26][27][28]. However, the existing studies did not include the initial stresses or pre-stresses in their analysis except studies [9,11,16], but they [9,11,16] studied production stage only.…”
Section: Accepted Manuscriptmentioning
confidence: 99%
“…Temp. dependent [37][38][39] 0.28 [13,23] 2330 [23] Copper 117 [43,44] 17 [14,45] 0.35 [12] 8960 [46] Solder (Sn95.5Ag3.8Cu0.…”
Section: Materials Propertiesmentioning
confidence: 99%