Thermomechanics of solids with general imperfect coherent interfaces

J. Mech. Mater. Struct.

2017

To date, the effects of interface in-plane damage on the thermo-mechanical response of a thermally general imperfect (GI) and mechanically coherent energetic interface are not taken into account. A thermally GI interface allows for a discontinuity in temperature as well as in the normal heat flux across the interface. A mechanically coherent energetic interface permits a discontinuity in the normal traction but not in the displacement field across the interface. The temperature of a thermally GI interface is a degree of freedom and is computed using a material parameter known as the sensitivity. The current work is the continuation of the model developed in [21] where a degrading highly-conductive (HC) and mechanically coherent energetic interface is considered. An HC interface only allows for the jump in normal heat flux and not the jump in temperature across the interface. In this contribution, a thermodynamically consistent theory for thermally general imperfect and mechanically coherent energetic interfaces subject to in-plane degradation is developed. A computational framework to model this class of interfaces using the finite element method is established. In particular, the influence of the interface in-plane degradation on the sensitivity is captured. To this end the equations governing a fully non-linear transient problem are given. They are solved using the finite element method.The results are illustrated through a series of three-dimensional numerical examples for various interfacial parameters. In particular, a comparison is made between the results of the intact and the degraded thermally GI interface formulation.

Section: Computational Frameworkmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

Coupled thermally general imperfect and mechanically coherent energetic interfaces subject to in-plane degradation

J. Mech. Mater. Struct.

2017

“…-Lowly-conductive (LC or Kapitza) 1 allowing only for a jump in temperature, i.e. Duan and Karihaloo, 2007;Hasselman and Johnson, 1987;Lipton and Vernescu, 1996;Nan et al, 1997;Torquato and Rintoul, 1995;Yvonnet et al, 2011a;Javili et al, 2012 , Benveniste, 2006;2013;Gu et al, 2011;Hashin, 2001;Javili et al, 2014a;Wang et al, 2005;Kaessmair et al, 2014 , for further details).…”

Section: Introductionmentioning

confidence: 99%

A thermo-mechanical cohesive zone model accounting for mechanically energetic Kapitza interfaces

International Journal of Solids and Structures

2016

Self Cite

a b s t r a c tInterfaces can play a dominant role in the thermo-mechanical response of a body. The importance of interfaces is more pronounced as the problem scale decreases since the interface area to the bulk volume ratio grows. The objective of this contribution is to study computational aspects of modeling thermomechanical solids containing mechanically energetic, geometrically non-coherent Kapitza interfaces under cyclic loading. The interface is termed energetic in the sense that it possesses its own energy, entropy, constitutive relations and dissipation. To date, classical thermo-mechanical cohesive zone models do not account for elastic interfaces. Therefore we propose a novel interface model that couples the classical cohesive zone formulation to the interface elasticity theory under the Kapitza assumption within a thermomechanical framework. In other words, such an interface model allows for discontinuities in geometry, temperature and normal stress fields, while not permitting a jump in the normal heat flux across the interface.The equations governing a fully non-linear transient problem are given. They are solved using the finite element method. The results are illustrated through a series of three-dimensional numerical examples for various interfacial parameters. In particular, a comparison is made between the results of the classical thermo-mechanical cohesive zone model and our novel (cohesive + energetic Kapitza) interface formulation.

“…A thermally perfect interface does not allow for a discontinuity in either temperature or normal heat flux across the interface (see, for instance, [5,25] for further details). An imperfect thermal interface, on the other hand can either be highly conductive allowing for solely a discontinuity in normal heat flux and not in temperature [see [26][27][28][29][30][31], for further details]; or be lowly conductive admitting only a discontinuity in temperature and not in normal heat flux (see [26,[32][33][34][35][36][37] for further details); or be general imperfect permitting discontinuities in both temperature and normal heat flux (see [14,[38][39][40][41][42][43] for further details), across the interface. Note that a thermal interface is non-energetic and may allow for conduction along the interface.…”

Section: Introductionmentioning

confidence: 99%

Highly-conductive energetic coherent interfaces subject to in-plane degradation

Mathematics and Mechanics of Solids

2016

The presence of an interface can influence the thermo-mechanical response of a body. This influence is especially pronounced at small scales where the interface area to bulk volume ratio significantly increases. Since the thermomechanical properties of an interface can differ from those of the bulk, within interface continuum theory an interface is endowed with its own thermo-mechanical energetic structure. To date, the effects of interface in-plane damage on the thermo-mechanical response of a highly conductive interface have not been accounted for. Therefore in this contribution the computational aspects of thermo-mechanical solids containing highly conductive interfaces subject to in-plane degradation are studied. To this end, the equations governing a fully non-linear transient problem are given. They are solved using the finite element method. The results are illustrated through a series of three-dimensional numerical examples for various interfacial parameters. In particular a comparison is made between the results of the intact and the degraded highly conductive interface formulation.