“…In order to reduce the Te precipitates, Vydyanath et al [6,11] carried out wafer annealing of CdZnTe containing Te precipitates, over the temperature range of 500-900 • C, using Cd/Zn pressures appropriate to stoichiometry, and postulated that the reported removal of large Te precipitates could result from migration of the second-phase material under the action of temperature gradients if the Te melting point is exceeded during the wafer annealing. However, it is noted that this process may be at the expense of an increase in dislocation density and rocking curve width.…”