2024
DOI: 10.15407/polymerj.46.01.047
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Thermophysical and adhesive properties of functional polymer materials based on epoxy resin and silicon-containing component

Larysa Gorbach,
Valeriy Davydenko,
Liubov Vorontsova
et al.

Abstract: The work was aimed at developing an adhesive formulation with increased adhesive strength for metals. It contains an epoxy resin of the bisphenol type СHS-TROXY 520 (an analogue of ED-20), an amine hardener triethanolamine (TEA) and a silicon-containing component (3-isocyanatopropyl)triethoxysilane, designated as NCO-Si, with an optimal ratio of components. The content of NCO-Si in the formulations was 0.5, 1.0, 3.0 and 5.0 wt. %, respectively. The gradual transformation of the epoxy system into a three-dimens… Show more

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