2015
DOI: 10.1007/s11182-015-0491-z
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Thermophysical Properties of Polymer Materials with High Thermal Conductivity

Abstract: Results of studies on the main thermophysical properties of new thermally conductive polymer materials are presented. It is shown that modification of polymer dielectrics by micron-sized fillers allows thermally conductive materials with thermal conductivity not less than 2 W/(mK) to be produced, which makes it possible to use such materials as cooling elements of various electrical engineering and semiconductor equipment and devices.

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Cited by 3 publications
(4 citation statements)
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“…Lebedev and Gefle worked on enhancing thermal conductivity and thermal diffusivity by incorporating micro and sub-micro particles with high thermal conductivity into the polymer matrix. [69] Linear low-density polyethylene (LLDPE) was used as a polymer matrix with GE-3 graphite grade and with the mean particle size of 65 μm at various filler contents of 0-30 vol%. Thermally conductive composites with K eff as high as 6.5 Wm À1 K À1 are produced and the percolation threshold at 10-15 vol% is observed.…”
Section: Micro Filled Compositesmentioning
confidence: 99%
“…Lebedev and Gefle worked on enhancing thermal conductivity and thermal diffusivity by incorporating micro and sub-micro particles with high thermal conductivity into the polymer matrix. [69] Linear low-density polyethylene (LLDPE) was used as a polymer matrix with GE-3 graphite grade and with the mean particle size of 65 μm at various filler contents of 0-30 vol%. Thermally conductive composites with K eff as high as 6.5 Wm À1 K À1 are produced and the percolation threshold at 10-15 vol% is observed.…”
Section: Micro Filled Compositesmentioning
confidence: 99%
“…Therefore, the main challenge to obtaining a consistent flow of thermally conductive composite during printing is to achieve percolation at low filler content to keep the viscosity within workable range. Therefore, to enhance TC, a low thermal percolation threshold is necessary in order to process the composite by FDM [38]. Different parameters play a key role in defining the optimal percolation value such as the cost of the functional material, the 3D printer specifications (e.g.…”
Section: Rheologymentioning
confidence: 99%
“…An interconnected system of filler particles (3D network) is needed to create a conductive path. Lebedev et al [38] prepared composites of PLA with graphite and CNTs using a mixer having counter-rotating blades before post-processing by FDM. They were able to obtain a TC of 4 W/mK for composites with 30 wt% graphite and 1 wt% CNTs (TC method: hot wire).…”
Section: Void Formation and Printing Direction Effects On Tcmentioning
confidence: 99%
“…Thermally conductive polymer materials and their characterization. Filled polymer materials on the basis of polyamide (PA) and linear low density polyethylene (LLDPE) were used for fabrication of heat sinks for LED lamps [12]. All TCPMs were prepared by means of the twin screw extruder TSE 20/40D (Brabender, Germany).…”
Section: Experimental Samples and Techniquementioning
confidence: 99%