Thermoplastic bonding (TPB) of TiAl- and Ni-based alloys with Zr-Al-Ni-Cu bulk metallic glass

Investigation of atomic diffusion at Ni/Zr48Cu36Ag8Al8 interfaces in the glass transition temperature

“…There remain technological challenges solving the problem of sample size and brittleness at room temperature 3 . With more investigations on composites by in situ and ex situ reinforcement and diffusion bonding between BMG and crystal metal (e.g., superplastical diffusion bonding, 4,5 semisolid forging, 6 explosive welding, 7 and coextrusion 8,9 ), the quality of the interdiffusion bonding plays a vital role in macroscopic mechanical response. However, the formation of the crystalline phase near the interface between metallic glass and crystal metal during diffusion processing is hard to control 10,11 because the BMGs easily undergo various atomic rearrangement above T g .…”