“…Most recently, piezoelectric thick films with thickness in the range of 10-100 m have attracted significant attention. They have been widely applied to micropumps, ultrasonic motors, resonators, microfluidic separators, high frequency transducers, and energy harvesting [16,17], because they exhibit properties such as larger displacement and quick response, high frequency, and can be precisely controlled [17]. However, the thick films are difficult to produce using lapping and machining bulk ceramics due to the expense, waste and difficulty in handling the ceramics, on the other hand, most of the thin film processing, such as sol-gel, sputtering, physical vapour deposition, chemical vapour deposition, and pulsed laser deposition are not practical due to the slow deposition rates and high levels of stress generated during processing which can lead to cracking of the film [18].…”