Thick-film printing of PZT onto silicon

Maas, R.; Koch, Michael; Harris, N.R.; White, Neil; Evans, A G R

doi:10.1016/s0167-577x(96)00249-2

Cited by 89 publications

(46 citation statements)

References 1 publication

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“…Work at the University of Southampton has been progressing to develop an alternative to bonded bulk PZT for silicon MEMS actuators by utilizing thick-film processing. Thick-film deposition represents a convenient way of depositing active materials, and developments in processing [1] and paste formulation [2] have allowed the technology to be migrated to silicon. It gives several advantages over bonding bulk material in that it is inherently a batch process, so an entire wafer of devices can be printed in one go.…”

Section: Introductionmentioning

confidence: 99%

A multilayer thick-film PZT actuator for MEMs applications

Harris

Hill

Torah

et al. 2006

Sensors and Actuators A: Physical

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This paper describes a technique for replacing the conventional bonded bulk PZT transducer, commonly used in MEMS devices, with a screen printed equivalent. Previously, the piezoelectric activity available from screen printed PZT has been considerably lower than the bulk material, but recent developments in material composition and device structure have allowed screen printed structures to deliver powers equivalent to bulk devices. An actuator using the multilayer screen printed technique was designed for use in an ultrasonic flow-through separator, and its successful use is reported.

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Section: Introductionmentioning

confidence: 99%

A multilayer thick-film PZT actuator for MEMs applications

Harris

Hill

Torah

et al. 2006

Sensors and Actuators A: Physical

Self Cite

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“…Thick layers with thickness up to 100 µm can be fabricated using the screen printing method. Maas et al describes at [82] of printing PZT onto silicon, the powdered PZT is mixed with boro-silicate glass powder and an organic vehicle to make a paste, it is the ink. The layer is printed, dried to remove the solvent and finally fired.…”

Section: Piezoelectric Materialsmentioning

confidence: 99%

MEMS Technologies for Energy Harvesting

Domínguez-Pumar

Pons-Nin

Chávez-Domínguez

2016

Nonlinearity in Energy Harvesting Systems

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The objective of this chapter is to introduce the technology of Microelectromechanical Systems, MEMS, and its application to emerging energy harvesting devices. The chapter begins with a general introduction to the most common MEMS fabrication processes. Next, the chapter follows with a survey of design mechanisms implemented in MEMS energy harvesters to provide nonlinear mechanical actuations. Mechanisms to produce bistable potential will be studied, such as by placing fixed magnets, buckling of beams, or by using slightly slanted clamped-clamped beams. Other nonlinear mechanisms are studied such as impact energy transfer, or the design of nonlinear springs. Finally, due to their importance in the field of MEMS and their application to energy harvesters, an introduction to the actuation with piezoelectric materials is made. Examples of energy harvesters found in the literature using this actuation principle are also presented.

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“…Screen printed lead zirconate titanate (PZT) thick films have been used in numerous micro electromechanical systems (MEMS) applications such as micropumps [4,6,8], accelerometers [1] and resonant sensors [2]. The approach is attractive since it is a simple, low-cost process for depositing thick layers of piezoelectric material in the desired pattern.…”

Section: Introductionmentioning

confidence: 99%

Photoresist patterned thick-film piezoelectric elements on silicon

et al. 2007

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A fundamental limitation of screen printing is the achievable alignment accuracy and resolution. This paper presents details of a thick-resist process that improves both of these factors. The technique involves exposing/developing a thick resist to form the desired pattern and then filling the features with thick film material using a doctor blading process. Registration accuracy comparable with standard photolithographic processes has been achieved resulting in minimum feature sizes of <50 μm and a film thickness of 100 μm. Piezoelectric elements have been successfully poled on a platinised silicon wafer with a measured d 33 value of 60 pCN −1 .

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Thick-film printing of PZT onto silicon

Cited by 89 publications

References 1 publication

A multilayer thick-film PZT actuator for MEMs applications

A multilayer thick-film PZT actuator for MEMs applications

MEMS Technologies for Energy Harvesting

Photoresist patterned thick-film piezoelectric elements on silicon

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