Thick Film with Low Resistivity Formed by Ultrafine Particles of Ag and Pd Single Crystals.

Kasukabe, Susumu

doi:10.2497/jjspm.39.231

Cited by 2 publications

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“…According to other research, 20,22 high densification is helpful to the electrical conductance. However, the densification of the film with composition C was much better than that of the film with composition D, as shown by Figs.…”

Section: Electrical Resistivitymentioning

confidence: 89%

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Low-temperature air-fireable glass-free metallic thick-film electrical conductor materials

Liu

Chung

2001

Journal of Elec Materi

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Low-temperature air-fireable glass-free metallic thick-film electrical conductor materials were developed for interconnections in electronic packaging. The thick film with composition (by weight) 96.60%Ag, 1.38%Cu, 0.28%Al, 0.35%Ti, and 1.39%Sn used Ti-Al as the active binder. After firing in air at 500∞C it exhibited low electrical resistivity (6.2 ¥ 10 -6 W·cm), good scratch resistance and strong bonding with the alumina substrate, with no pinholes. The firing caused complete melting of the particles in the film. Firing in argon rather than air degraded both electrical and bonding properties, due to the absence of oxygen, which helped to burn out the vehicle. The use of Ti rather than Ti-Al as the active binder resulted in holes in the thick film due to incomplete melting of the Ti-rich particles and also resulted in poor scratch resistance and weaker bonding to the substrate. Tin in the composition was important for promoting melting and protecting the active particles from oxidation during firing.

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Section: Electrical Resistivitymentioning

confidence: 89%

“…This resulted partly from its high densification and partly from reaction bonding. 20 The particle used in this work was much smaller in size than that used in previous work, 15 especially for the active elemental particles. A small particle size leads to a low melting point, according to Kasukabe.…”

Section: And the Substratementioning

confidence: 95%

Low-temperature air-fireable glass-free metallic thick-film electrical conductor materials

Liu

Chung

2001

Journal of Elec Materi

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Low-temperature air-fireable glass-free metallic thick-film electrical conductor materials

Liu

Chung

2002

Journal of Elec Materi

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Fig. 1 The surface of the thick film with composition C after firing at 900°C in argon, showing the incomplete melting of silver particles and the presence of gaps. The round particles were silver. Fig. 2 The surface of the thick film with composition D after firing at 900°C in argon, showing essentially complete melting of silver particles and the presence of gaps.The following corrections are needed due to an experimental error.Delete "Low-temperature" in the title.Delete "Low-temperature in the first sentence in the abstract.Change 500ºC to 932ºC in this paper including Table 2.Change 455ºC to 850ºC in this paper including Table 2.Delete "Low-temperature" in the first sentence in the Conclusions part. Table I as 96.60% Ag, 2.38% Cu, 0.90% Sn, 0.12% Ti. Change composition D inIn order to compare the effect of firing compositions C and D in air and that of firing them in argon, additional work was conducted by firing compositions C (96.60% Ag, 1.38% Cu, 0.28% Al, 0.35% Ti, 1.39% Sn) and D in argon at 900ºC (in addition to the 600ºC firing reported in the original paper) for 60 min at a heating rate of 20ºC/min. This work was necessitated by the temperature correction mentioned above. The surface of the thick film with composition C after firing at 900ºC in argon is shown in Fig. 1 of this Erratum. Incomplete melting of silver particles and gaps were observed. Figure 2 of this Erratum shows the surface of the thick film with composition D after firing at 900ºC in argon. Most silver particles melted. However, gaps also occurred. In addition, parts of both thick films (not shown) were burnt out. Photographs of the scratched films of compositions C and D after firing at 900ºC (not shown) are similar to those of the films fired at 600ºC in argon (Fig. 13 in the original paper). Almost the entire substrate was exposed after scratching.In order to study the effect of oxygen during firing, additional work was conducted by firing compositions C and D at 932ºC in argon (rather than air). This firing resulted in more burn-out than firing at 900ºC in argon, as only an ash-like residue remained on the Al 2 O 3 substrate. In contrast, firing at 932ºC in air resulted in a superior thick film with no gaps for both compositions C and D, as reported in

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Thick Film with Low Resistivity Formed by Ultrafine Particles of Ag and Pd Single Crystals.

Cited by 2 publications

References 0 publications

Low-temperature air-fireable glass-free metallic thick-film electrical conductor materials

Low-temperature air-fireable glass-free metallic thick-film electrical conductor materials

Low-temperature air-fireable glass-free metallic thick-film electrical conductor materials

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