Abstract:In this study, we suggest a method to measure the thickness of thin films nondestructively using the dispersion characteristics of a surface acoustic wave propagating along the thin film surface. To measure the thickness of thin films, we deposited thin films with different thicknesses with range of 200~1000 nm on a Si(100) wafer by controlling the deposition time by DC sputtering technique. The thickness of the thin films was measured using a scanning electron microscope. Subsequently, the surface wave veloci… Show more
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