Thin Bondline Measurement of Adhesively Bonded Metallic Aircraft Structures using an Ultrasonic Analyzer

Wongwiwat, W.; Rizzo, R.; Rigney, D.

doi:10.1007/978-1-4615-3742-7_31

Review of Progress in Quantitative Nondestructive Evaluation 1991

DOI: 10.1007/978-1-4615-3742-7_31

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Thin Bondline Measurement of Adhesively Bonded Metallic Aircraft Structures using an Ultrasonic Analyzer

W. Wongwiwat¹,

R. Rizzo

D. Rigney³

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Thin Bondline Measurement of Adhesively Bonded Metallic Aircraft Structures using an Ultrasonic Analyzer

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