Proceedings of the 2015 Third International Conference on Computer, Communication, Control and Information Technology (C3IT) 2015
DOI: 10.1109/c3it.2015.7060223
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Thin domain wide electrode (TDWE) phantoms for Electrical Impedance Tomography (EIT)

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Cited by 3 publications
(2 citation statements)
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“…However, the equipotential surface obtained from the numerical analysis displays an equivalent flat equipotential surface of length l eq = 2r for the given condition. Previous studies on electrical impedance tomography (EIT) have noted changes in the electrical field and equipotential surface for different electrode configurations around the perimeter of a circular cross-section [19][20][21]. However, such previous studies are primarily focused on the tomographic results, and the changes in the shape of the equipotential surface have not been adequately modelled.…”
Section: Distortion Of the Equipotential Surfacementioning
confidence: 99%
“…However, the equipotential surface obtained from the numerical analysis displays an equivalent flat equipotential surface of length l eq = 2r for the given condition. Previous studies on electrical impedance tomography (EIT) have noted changes in the electrical field and equipotential surface for different electrode configurations around the perimeter of a circular cross-section [19][20][21]. However, such previous studies are primarily focused on the tomographic results, and the changes in the shape of the equipotential surface have not been adequately modelled.…”
Section: Distortion Of the Equipotential Surfacementioning
confidence: 99%
“…Conductive copper and insulative nylon objects, which resemble the human heart and lungs, are inserted into the container to simulate perturbations in the conductive medium. This type of phantom is very hard to reproduce the same measurement result due to the fluctuation in conductivity, such as the exact placement of objects, evaporation of saline water, and its concentration [21], [22], [25], [28]. (ii) Mesh phantom consists of a network of resistors soldered onto the printed circuit board (PCB), where the topology of interconnection creates the corresponding shape, size, and conductivity distribution [30], [31], [37], [38].…”
Section: Introductionmentioning
confidence: 99%