1970
DOI: 10.1080/0021846708544600
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Thin Film Adhesion: Effect of Glow Discharge on Substrate

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Cited by 14 publications
(2 citation statements)
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“…The adhesive used for glueing was Eastman 910. Subsequently, the technique has been used by Butler et al, 3 o and Stoddart et aL 31 Wieckowski 32 has analysed the methods for checking adhesion of conductive thin films and has concluded that the method of detachment using a side force seems to be the best. The objections regarding the use of adhesives or solders also apply to this modification as discussed for the direct pull-off method.…”
Section: Mechanical Methodsmentioning
confidence: 99%
“…The adhesive used for glueing was Eastman 910. Subsequently, the technique has been used by Butler et al, 3 o and Stoddart et aL 31 Wieckowski 32 has analysed the methods for checking adhesion of conductive thin films and has concluded that the method of detachment using a side force seems to be the best. The objections regarding the use of adhesives or solders also apply to this modification as discussed for the direct pull-off method.…”
Section: Mechanical Methodsmentioning
confidence: 99%
“…In order to be functional the thin film has to be adherent to the substrate. Various methods like deposition on hot substrate (Pulkar 1982;Martin et al 1983;Pierce and Vaugham 1983}, deposition in presence of plasma or glow discharge cleaning (Stoddart et al 1970;Fancey and Mathews 1990;Pulkar et al 1990}, deposition of bonding layer (Mattox 1973), etc have been reported to increase the adhesion of the films.…”
Section: Introductionmentioning
confidence: 99%