Thin Film Encapsulation for RF MEMS in 5G and Modern Telecommunication Systems

Abstract

In this work, SiNx/a-Si/SiNx caps on conductive coplanar waveguides (CPWs) are proposed for thin film encapsulation of radio-frequency microelectromechanical systems (RF MEMS), in view of the application of these devices in fifth generation (5G) and modern telecommunication systems. Simplification and cost reduction of the fabrication process were obtained, using two etching processes in the same barrel chamber to create a matrix of holes through the capping layer and to remove the sacrificial layer under the cap. Encapsulating layers with etch holes of different size and density were fabricated to evaluate the removal of the sacrificial layer as a function of the percentage of the cap perforated area. Barrel etching process parameters also varied. Finally, a full three-dimensional finite element method-based simulation model was developed to predict the impact of fabricated thin film encapsulating caps on RF performance of CPWs.

A comprehensive overview of recent developments in RF-MEMS technology-based high-performance passive components for applications in the 5G and future telecommunications scenarios

“…An interesting contribution is represented by [58], in which an investigation regarding the amount of perforated area on the thin film for the proper release of encapsulated devices is reported. In this work, thin film layer is perforated with holes of different diameters (7 and 8 μm), and different realizations of perforated films are obtained, each one with a different percentage of perforated area.…”

5G and its impact on environment, biodiversity and human health: An overview

“…The RF down converter is necessary to boost the wireless system's dynamic range, while the mixer stage is also a bonus for the entire Wi-Fi network to make a significant contribution to the total gain [18] . The Radiofrequency micro electro mechanical systems (RF MEMS) technology is emerging as a critical approach for meeting the challenging specifications of passive devices and networks of the next fifth (5G) generation technologies, including elevated operating frequencies, large tuning capability, decreased hardware reliability and low power consumption [19] . Aside from RF wireless techniques, which in particular were banned by international treaties as a tool of military-grade, we should establish alternate approaches based on proven electromagnet theories [20] .…”

Effects of annealing temperature on micro deep drawing of stainless steel-copper composite

“…With broad development prospects and high theoretical and practical value, microforming technology is becoming one of the most promising technologies in the 21st century [1]. In recent years, with the advancement of modern science and technology, the trend of product miniaturization is accelerating, and the application of the micro metallic parts fabricated by micro deep drawing (MDD) is increasing in the fields of micro-electromechanical systems (MEMS) [2], transportation [3], electronic communication [4], medical equipment [5] and instrumentation [6]. Researchers at home and abroad have done tremendous work on MDD in theory, experiment and IOP Publishing doi:10.1088/1757-899X/1270/1/012092 2 simulation.…”