2000
DOI: 10.1109/20.908643
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Thin film processing by biased target ion beam deposition

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Cited by 34 publications
(18 citation statements)
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“…The key feature of this BTIBD system is that, instead of using conventional gridded ion source, it uses low energy ion sources that combine with end-Hall ion and hollow cathode electron sources. 4 High purity methane (CH 4 ) gas was mixed with Argon (Ar) gas in the ratio of 1:1 and used as a carbon source to deposit both DLC and W-DLC¯lms. The hydrocarbon ion energy was optimized and adjusted to 35 eV with an ion current of 1.75 A and this was kept constant throughout the deposition.…”
Section: Methodsmentioning
confidence: 99%
“…The key feature of this BTIBD system is that, instead of using conventional gridded ion source, it uses low energy ion sources that combine with end-Hall ion and hollow cathode electron sources. 4 High purity methane (CH 4 ) gas was mixed with Argon (Ar) gas in the ratio of 1:1 and used as a carbon source to deposit both DLC and W-DLC¯lms. The hydrocarbon ion energy was optimized and adjusted to 35 eV with an ion current of 1.75 A and this was kept constant throughout the deposition.…”
Section: Methodsmentioning
confidence: 99%
“…Additional details of our BTIBD system can also be found elsewhere. 2,12 There are two identical ion guns installed in the BTIBD, one for main deposition and the other for ion beam assisted deposition. In the present work, for simplicity, only the main gun was used for the MTJ depositions.…”
Section: Methodsmentioning
confidence: 99%
“…3 This is because it is harder to focus the sputtering ion beam at low energies, meaning a larger fraction of the ion beam could miss the targets and sputter off undesired materials from the vacuum system hardware, causing an overspill contamination. 2 Hence, using higher acceleration voltages better focuses the ion beam on the target. Unfortunately, this also gives the adatoms higher kinetic energies when they reach the substrate, causing intermixing problems at the interfaces, which is detrimental to the TMR performance.…”
Section: Introductionmentioning
confidence: 99%
“…The IBD has the advantages of independent control of target and substrate environments, low processing pressures, low sputtering rate, directional sputtered flux, and high adatom flux energy; however it is not suitable for optimum conditions for multilayer deposition, because conventional IBD uses relatively high sputtering ion energies to better focus the ion beam on the target 14,15 . The focused beam is used to prevent the overspill contamination when a large fraction of an unfocused ion beam miss the targets and sputters off other materials from hardware inside the vacuum chamber 16 .…”
Section: A Recently Proposed Josephsonmentioning
confidence: 99%