Thin-film thickness profile measurement by three-wavelength interference color analysis

Kitagawa, Katsuichi

doi:10.1364/ao.52.001998

Cited by 59 publications

(37 citation statements)

References 10 publications

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“…There are a few examples where color cameras separate the light by color [175][176][177][178], but they have been peripheral to the main channel of development.…”

Section: True Color Imagingmentioning

confidence: 99%

Principles of interference microscopy for the measurement of surface topography

Groot¹

2015

Adv. Opt. Photon.

307

168

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Interference microscopy plays a central role in noncontact strategies for process development and quality control, providing full 3D measurement of surface characteristics that influence the functional behavior of manufactured parts. Here I briefly review the history and principles of this important technique, then concentrate on the details of hardware, software, and applications of interference microscopy using phase-shifting and coherence scanning measurement principles. Recent advances considered here include performance improvements, vibration robustness, full color imaging, accommodation of highly sloped surfaces, correlation to contact methods, transparent film analysis, and international standardization of calibration and specification.

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“…There are a few examples where color cameras separate the light by color [175][176][177][178], but they have been peripheral to the main channel of development.…”

Section: True Color Imagingmentioning

confidence: 99%

Principles of interference microscopy for the measurement of surface topography

Groot¹

2015

Adv. Opt. Photon.

307

168

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“…The thickness of the lubricant film was measured by colorimetric interferometry by M. Hartl et al 23 . The thickness profile was measured using the interference colour analysis by K. Kitagawa et al 24 . A very high optical contrast upon switching between the amorphous and crystalline phases depending on the film thickness was demonstrated by P. Hosseini et al 25 .…”

mentioning

confidence: 99%

Colour-Difference Measurement Method for Evaluation of Quality of Electrolessly Deposited Copper on Polymer after Laser-Induced Selective Activation

Gedvilas

Ratautas

Kacar

et al. 2016

Sci Rep

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In this work a novel colour-difference measurement method for the quality evaluation of copper deposited on a polymer is proposed. Laser-induced selective activation (LISA) was performed onto the surface of the polycarbonate/acrylonitrile butadiene styrene (PC/ABS) polymer by using nanosecond laser irradiation. The laser activated PC/ABS polymer was copper plated by using the electroless copper plating (ECP) procedure. The sheet resistance measured by using a four-point probe technique was found to decrease by the power law with the colour-difference of the sample images after LISA and ECP procedures. The percolation theory of the electrical conductivity of the insulator conductor mixture has been adopted in order to explain the experimental results. The new proposed method was used to determine an optimal set of the laser processing parameters for best plating conditions.Polymer-based electrical devices are used in different areas such as optical communications, biomedicine, and automotive industry 1,2 . Formation of the electrical circuits on polymers is important for these devices. There are many techniques called "selective metallization" to produce a circuit on the surface of polymers: direct chemical plating 3 , laser direct structuring (ablation and writing) 4,5 , laser direct imaging 6 and laser-induced selective activation (LISA) [7][8][9][10][11] .LISA was developed for selective metallization of polymers for three-dimensional moulded interconnecting devices. This method contains single step: laser structuring of the polymer surface. As a result of the laser structuring, sponge-like and nano-porous structures are created to improve the adhesion strength of the metal to the polymer. After LISA process the metal layer is deposited by the electroless copper plating (ECP) procedure. The ECP contains of three-steps: activation of the laser-structured surface with palladium colloidal activator; cleaning with distilled water; electroless deposition of copper layer on the activated sample. In the activation procedure, palladium atoms are trapped in a porous sponge like structures on the polymer surface. Cleaning with distilled water removes unwanted palladium from flat unstructured polymer and leaves it confined in the poriferous surface. The copper fills all the openings in the polymer and a porous, rough metal film is deposited during the final step of the ECP. Finally, after both, LISA and ECP procedures, the copper layer is deposited selectively only onto the laser structured areas while unstructured polymer is not coated with the metal deposition.The electrical and optical properties of the semi-transparent films were investigated in numerous works [12][13][14][15][16][17][18][19] . However, the analysis of the sheet resistance dependence on the optical transmittance can be applied only for films with the thicknesses smaller than the absorption depth. Such kind of measurements cannot be realized with a relatively thick metal layer on the porous opaque substrate.The characterization of the cross section of...

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“…An alternative approach is to determine thickness by evaluating the tint in Newton color interferences. This principle has already been applied to semiconductor films [4], magnetic head heights [5], friction phenomena [6], and SiO 2 layers (minimum 100nm thick) on silicon substrate [7]. However, color interferometry methods have rarely been applied in the industry because they require repeated calibration due to complex relationship (due to lighting and target film structure) between color and thickness.…”

Section: Introductionmentioning

confidence: 99%

Full-field and contact-less topography of nanometric thin films based on multiwavelength interferometry

Picart¹,

Malek²,

Garcı́a-Sucerquia³

et al. 2015

SPIE Proceedings

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This paper discusses a method to measure the thickness of thin layers deposited on a reflective substrate. A Michelson type interferometer with three wavelengths produces color interferences. A color sensor records the tint that is produced. The color interferences are approximated by a model based on the measurement of the laser intensities obtained with the reference mirror only. An iterative process leads to unambiguous algorithmic convergence and high accuracy thickness measurement. This method is simple, robust, compact, and single shot. The method does not need for angular scanning over the field of measurement (about 75mm 2 ). The measurement on the surface yields a histogram of the thickness distribution and there is no requirement for any reference points (e.g. no need to make a groove or a walk on the layer). A thickness measurement performance of 50nm was demonstrated for homogenous polymer films deposited on silicon wafer. Set-up and digital image processing are discussed.

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Thin-film thickness profile measurement by three-wavelength interference color analysis

Cited by 59 publications

References 10 publications

Principles of interference microscopy for the measurement of surface topography

Principles of interference microscopy for the measurement of surface topography

Colour-Difference Measurement Method for Evaluation of Quality of Electrolessly Deposited Copper on Polymer after Laser-Induced Selective Activation

Full-field and contact-less topography of nanometric thin films based on multiwavelength interferometry

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