“…In order to prepare Cu 2 O thin film, the most straightforward way is the controlled oxidation of a precursor Cu layer 21,22 or using more advanced variations such as radical oxidation by O 2 plasma, 23 all of which are simple methods that could produce good quality Cu 2 O films. However, for device fabrication, the need to obtain high fieldeffect mobility along with the multiple-phase nature of Cu-O material system (Cu, Cu 2 O, and CuO) have led to the focus on complex vacuum-based deposition techniques such as pulsedlaser deposition (PLD) 14,24 and sputtering 25,26 with the aim to produce single-phase, high-quality Cu 2 O films for transistor applications. These methods, however, rely on stringent experimental conditions and are incompatible with high-throughput manufacturing processes, especially when compared to solution-based deposition techniques.…”