1996
DOI: 10.1007/bf00033828
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Thin plate bending of dissimilar half-planes with interface debonding emanating from an elliptical hole

Abstract: The problem of thin plate bending of two bonded dissimilar half-planes containing an elliptical hole on the interface with debonding emanating on both sides is presented. The external load is a uniformly distributed bending moment applied at infinity perpendicular to the interface. An analytical solution is obtained using the complex stress function approach and the rational mapping function technique. Stress distributions on the interface, the boundaries of the hole and in the vicinity of the debonded tips ar… Show more

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Cited by 8 publications
(4 citation statements)
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“…Based on our experience, the parameter N is chosen as 28 in this study. Details of this procedure are described in [8,18]. From Fig.…”
Section: Statement Of the Problemmentioning
confidence: 99%
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“…Based on our experience, the parameter N is chosen as 28 in this study. Details of this procedure are described in [8,18]. From Fig.…”
Section: Statement Of the Problemmentioning
confidence: 99%
“…Figures 6 and 7 show the stress distribution along the X-axis and the hole's boundary for two different point dislocations: Stress intensity of debonding Paper [8] studied two bonded dissimilar half-planes containing an elliptical hole with debonding occurring at the interface subjected to a uniform moment. A de®nition of the stress intensity of debonding for the thin plate bending problem is proposed for the debonding tips C and D (correspond to b and a in the t j plane shown in Fig.…”
Section: Stress Distributionmentioning
confidence: 99%
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