Abstract:Micro-channel heat sinks are currently at the forefront of cooling technologies for computer chips where the input heat flux is projected to exceed 100 W/cm2 [1, 2]. The quest for better heat-sink designs has produced different ideas, one of which is the idea of using multi-layered micro-channel heat sinks [3, 4]. The objectives of the present investigation were to conduct a detailed numerical study of the hydrodynamic and thermal behavior of a two-layered micro-channel heat sink and to compare the performance… Show more
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