2010
DOI: 10.1143/jjap.49.04de05
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Three-Dimensional Binocular Range Sensor LSI with Enhanced Correlation Signal

Abstract: We developed a three-dimensional (3D) binocular range sensor LSI with an enhanced correlation signal. The developed LSI chip was produced using a process of 0.35 µm complementary metal oxide semiconductor (CMOS) 1-poly 3-metal and has a die size of 4.20×3.33 mm2. The chip uses a 3.0 V supply voltage and has a power consumption of 280 mW at a clock frequency of 10 MHz. Two image sensors and the circuits for binocular stereo vision are integrated into the sensor. The distance to an object is determined by calcul… Show more

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Cited by 4 publications
(10 citation statements)
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“…We previously developed binocular range-sensor LSIs that solve the above problems [9,10,11]. We realized a small low-cost obstacle recognition system by integrating two image sensors and all the processing circuits on a single chip.…”
Section: Introductionmentioning
confidence: 99%
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“…We previously developed binocular range-sensor LSIs that solve the above problems [9,10,11]. We realized a small low-cost obstacle recognition system by integrating two image sensors and all the processing circuits on a single chip.…”
Section: Introductionmentioning
confidence: 99%
“…The APWC circuit can control the logic threshold value through the bias voltage [9,11]. If the bias voltage is changed with time, the output signal inverts when the logic threshold exceeds the input voltage.…”
Section: Introductionmentioning
confidence: 99%
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