Three-dimensional boron nitride reinforced thermal conductive composites with high elasticity

Lei, Bowen; Bai, Shuxin; Liang, Gengyuan; Ju, Sheng; Chen, Yin; Zhang, Jianwei

doi:10.1016/j.jallcom.2022.166046

Cited by 10 publications

(9 citation statements)

References 38 publications

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“…Most of the polymer materials are saturated systems, which have no free-moving electrons inside, and mainly rely on phonons for heat transfer. It is the most effective way to improve thermal conductivity by adding high thermal conductivity fillers into the polymer matrix [ 25 , 42 , 43 , 44 ]. The thermal conduction mechanism of filled thermal conductive composites mainly includes the thermal conduction pathways theory, thermal conduction percolation theory, and thermal elastic coefficient theory [ 22 , 45 , 46 , 47 ], of which the thermal conduction pathways theory is most accepted and applied by researchers.…”

Section: Heat Transfer Mechanism Of Filled Thermal Conductive and Ele...mentioning

confidence: 99%

“…Fillers commonly used in thermal conductive polymer composites include three types: metal fillers (silver, copper, aluminum), carbon-based fillers (carbon nanotubes, carbon fibers, graphene), and ceramic fillers (aluminum oxide, aluminum nitride, boron nitride) [ 2 , 17 , 25 , 26 , 71 , 72 , 73 , 74 , 75 , 76 , 77 ]. The values of thermal conductivity of various fillers at room temperature are shown in Table 2 [ 50 , 78 , 79 , 80 , 81 , 82 , 83 , 84 , 85 , 86 , 87 , 88 , 89 , 90 , 91 , 92 ].…”

Section: Factors Affecting Thermal Conductivity Of Thermal Conductive...mentioning

confidence: 99%

“…Although the thermal conductivity can be improved more effectively by high loadings or hybridizing fillers with different particle sizes and morphologies; however, as the filler particles are not in contact with each other directly, the polymer matrix with low thermal conductivity between them hinders the formation of continuous heat transfer pathways. Therefore, researchers have managed to control the distribution of fillers through various effective means, and then construct a completely continuous filler network [ 25 , 38 , 71 , 72 , 77 , 145 , 146 , 147 , 148 , 149 , 150 , 151 , 152 ]. This approach not only directly reduces the number/area of the interface between filler and matrix but also reduces the filler–filler interface, which fundamentally decreases the interfacial thermal resistance during heat transfer.…”

Section: Strategies For Enhancing Thermal Conductivity Of Polymer Com...mentioning

confidence: 99%

“…Lei et al [ 25 ] used a melamine formaldehyde resin sponge (MS) as the skeleton ( Figure 13 ) and successfully prepared the three-dimensional skeleton of the resin sponge wrapped by boron nitride nanosheets through the repeated layered assembly. Polyvinylidene fluoride (PVDF) was infiltrated into the framework of boron nitride by vacuum suction filtration process to prepare polyvinylidene fluoride (PVDF) composite, as shown in Figure 13 .…”

Section: Strategies For Enhancing Thermal Conductivity Of Polymer Com...mentioning

confidence: 99%

“…Thus, it is difficult to popularize and apply on a large scale to enhance thermal conductivity greatly. Compared with it, the second and most effective way is to prepare filled polymer composites by adding high thermal conductive fillers, such as alumina, boron nitride, carbon fiber, and silver particles, into the polymer matrix [ 24 , 25 , 26 , 27 , 28 , 29 , 30 , 31 ]. During the past few decades, numerous efforts have been devoted to designing and fabricating polymers and polymer composites with high thermal conductivity [ 13 , 32 , 33 , 34 , 35 , 36 , 37 , 38 , 39 ].…”

Section: Introductionmentioning

confidence: 99%

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Development and Perspectives of Thermal Conductive Polymer Composites

Wang

Hu²,

Li³

et al. 2022

Nanomaterials

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With the development of electronic appliances and electronic equipment towards miniaturization, lightweight and high-power density, the heat generated and accumulated by devices during high-speed operation seriously reduces the working efficiency and service life of the equipment. The key to solving this problem is to develop high-performance thermal management materials and improve the heat dissipation efficiency of the equipment. This paper mainly summarizes the research progress of polymer composites with high thermal conductivity and electrical insulation, including the thermal conductivity mechanism of composites, the factors affecting the thermal conductivity of composites, and the research status of thermally conductive and electrical insulation polymer composites in recent years. Finally, we look forward to the research focus and urgent problems that should be addressed of high-performance thermal conductive composites, which will provide strategies for further development and application of advanced thermal and electrical insulation composites.

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Section: Heat Transfer Mechanism Of Filled Thermal Conductive and Ele...mentioning

confidence: 99%

Section: Factors Affecting Thermal Conductivity Of Thermal Conductive...mentioning

confidence: 99%

Section: Strategies For Enhancing Thermal Conductivity Of Polymer Com...mentioning

confidence: 99%

Section: Strategies For Enhancing Thermal Conductivity Of Polymer Com...mentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Development and Perspectives of Thermal Conductive Polymer Composites

Wang

Hu²,

Li³

et al. 2022

Nanomaterials

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Highly thermally conductive and insulating PET nonwoven fabric/PDMS sandwich composite film by synergism of boron nitride nanosheets and alumina particles

Song

et al. 2023

Polymer Composites

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The accumulation of heat in electronic devices puts forward an urgent demand for thermal interface materials. It is still a great challenge to achieve the good comprehensive performance of high thermal conductivity (TC), insulation, flexibility and tensile strength. In this work, polyester‐based nonwoven fabric (NWF) was coated with boron nitride nanosheets (BNNS) by dispersion and interfacial reinforcement of cellulose nanofibers to obtain a three‐dimensional thermally conductive network skeleton (BNNS@NWF). The sandwich‐structured composite film was assembled by introducing alumina (Al2O3)/polydimethylsiloxane (PDMS) layers on the top and bottom surfaces of BNNS@NWF using scratch coating and hot pressing processes. The composite film has a high TC of 6.42 W/mK at 45.8 wt% BNNS content, and has excellent insulation with a volume resistivity of 1.06 × 1015 Ω cm. This is due to the long‐range effective thermal conduction path constructed by BNNS, the bridging effect of Al2O3 and the synergistic effect of the two fillers. PDMS helps the composite film maintain good flexibility and good TC stability after 30 bending cycles. The PET nonwoven interlayer gives the composite film good mechanical properties with a tensile strength of 17.5 MPa. This work provides a strategy for the efficient preparation of flexible composite films with high TC and insulation properties, which is of great importance for the development of innovative thermal interface materials.Highlights A sandwich‐structured composite film was prepared by a simple scale‐up method. Al2O3 and BNNS achieves synergistic enhancement of thermal conductivity. The film has a high thermal conductivity of 6.42 W/mK and electrical insulation. The film shows good flexibility, high tensile and thermal management properties.

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Functionalization of boron nitride with poly(catechol-polyamine) and bis(γ-triethoxysilylpropyl)tetrasulfide for preparing epoxy nanocomposites with enhanced thermal conductivity

Wu,

Yang,

Gao

et al. 2024

J Mater Sci: Mater Electron

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Hexagonal boron nitride (hBN) has garnered significant interest as inorganic thermally conductive material in electronic packaging due to its high-efficiency thermal management capability and electrical insulation properties. However, the relatively inert chemical environment of the BN surface hinders phonon transfer at the interface. Additionally, the high content of inorganic components in the matrix leads to the deterioration of the composite’s mechanical properties. In this research, h-BN surface is modified using poly(catechol-polyamine) (PCPA) and bis (γ-triethoxysi-lylpropyl)tetrasulphide (Si69) (denoted as BN-PCPA-Si69). The noncovalent PCPA modification protects the endothermic properties of BN, Si69 provides covalent bonding between thermally conductive fillers and bisphenol A-type epoxy resin (Ep), and the interfacial compatibility between BN and epoxy resin is improved. The heat conductivity of final BN/Ep composite achieved 0.817 W/(m·K) containing 30 wt% BN. Correspondingly, the heat conductivity of the composite (mBN/Ep) achieved 0.881 W/(m·K) containing 30 wt% BN-PCPA-Si69. Compared to pure epoxy resin (0.200 W/(m·K), the thermal conductivity (TC) of the mBN/Ep composite increased by 364% while maintaining good electrical insulation properties. The proposed BN surface functionalization approach has potential applications in fields such as microelectronic packaging, where materials need to balance high thermal conductivity and electrical insulation.

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Three-dimensional boron nitride reinforced thermal conductive composites with high elasticity

Cited by 10 publications

References 38 publications

Development and Perspectives of Thermal Conductive Polymer Composites

Development and Perspectives of Thermal Conductive Polymer Composites

Highly thermally conductive and insulating PET nonwoven fabric/PDMS sandwich composite film by synergism of boron nitride nanosheets and alumina particles

Functionalization of boron nitride with poly(catechol-polyamine) and bis(γ-triethoxysilylpropyl)tetrasulfide for preparing epoxy nanocomposites with enhanced thermal conductivity

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